Challenges Mount In New Autos

By John Koon - 06 Sep, 2022 - Comments: 0

Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

Virtualization In The Car

By Ann Mutschler - 06 Aug, 2020 - Comments: 1

As the automotive industry grapples with complexity due to electrification and increasing autonomy of vehicles, consolidation of ECUs within vehicles, more stringent safety and security requirements, automotive ecosystem players are looking to virtualization concepts in a number of ways to realize the vehicles of tomorrow. One way is with hardware virtualization; the ability of a device such... » read more

Embedded Software Verification Issues Grow

By Ann Mutschler - 08 Dec, 2016 - Comments: 0

Embedded software is becoming more critical in managing the power and performance of complex designs, but so far there is no consensus about the best way to approach it—and that's creating problems. Even with safety-critical standards such as DO-178C for aerospace and [gettech id="31076" comment="ISO 26262"] for automotive, different groups of tool providers approach software from differen... » read more

The Week In Review: Design

By Ed Sperling - 27 Jun, 2014 - Comments: 0

Tools eSilicon uncorked a GDSII online quote system for TSMC, which allows chipmakers to pick a variety of information ranging from process technology to package to yield and tapeout and production forecast and get a quote within minutes. This is a new twist in the value chain provider market. Synopsys added program to speed up FPGA-based prototype creation, which includes approved third-pa... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: QNX

Challenges Mount In New Autos

Virtualization In The Car

Embedded Software Verification Issues Grow

The Week In Review: Design

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Entities, people and technologies explored