tag: QP Technologies

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Aug, 2021 - Comments: 0

Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

Current And Future Packaging Trends
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Jul, 2021 - Comments: 0

Chipmakers and OEMs The industry is still wondering if Intel will buy GlobalFoundries (GF). In the meantime, GF has announced a fab expansion plan in upstate New York. These plans include immediate investments at its existing Fab 8 facility as well as construction of a new fab on the same campus. That will double the capacity at the site. Intel has reported its second-quarter 2021 financial... » read more

The Need For Open Molded Plastic Packages
By Rosie Medina - 22 Jul, 2021 - Comments: 0

When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts when you need them? If the answer is “no” or “it depends,” you’ll understand the value of having open molded plastic packages – plastic packages with open cavities – readily available for quick-turn assembly. OSATs are v... » read more

Piecing Together Chiplets
By Mark LaPedus - 22 Jul, 2021 - Comments: 3

Several companies are implementing the chiplet model as a means to develop next-generation 3D-like chip designs, but this methodology still has a long way to go before it becomes mainstream for the rest of the industry. It takes several pieces to bring up a 3D chip design using the chiplet model. A few large players have the pieces, though most are proprietary. Others are missing some key co... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jun, 2021 - Comments: 0

Fab tools TEL plans to ship its leading-edge coater/developer system to the joint Imec-ASML research lab, which is working on high-NA extreme ultraviolet (EUV) lithography. The equipment will be integrated with the EXE:5000, ASML’s next-generation high-NA EUV lithography system. The 0.55 numerical aperture (NA) tool is slated to be operational in 2023. Today's EUV is in production, but there... » read more

Fan-Out Packaging Options Grow
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a challenge. Fan-out is a way to assemble one or more dies in an advanced package, enabling chips with better performance and more I/Os for applications like computing, IoT, networking and sma... » read more

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