tag: Qualcomm

Five Trends In IC Packaging
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week in Review: IoT
By Jeff Dorsch - 10 Nov, 2017 - Comments: 0

Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

The Week In Review: Design
By Jesse Allen - 10 Nov, 2017 - Comments: 0

IP Cryptographic flaws have been discovered in the IEEE P1735 standard for encrypting IP and managing access rights. A team from the University of Florida found "a surprising number of cryptographic mistakes in the standard. In the most egregious cases, these mistakes enable attack vectors that allow us to recover the entire underlying plaintext IP." The researchers warn that an adversary coul... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

The Week in Review: IoT
By Jeff Dorsch - 03 Nov, 2017 - Comments: 0

Finance Farmobile has raised $18.1 million in a Series B round of funding, led by Anterra Capital and AmTrust Agricultural Insurance Services, bringing its total funding to more than $28 million. Existing investors also took part in the new round. The agricultural Internet of Things startup will use the money to expand its operations around the world. Farmobile provides agronomic and machine d... » read more

The Week in Review: IoT
By Jeff Dorsch - 27 Oct, 2017 - Comments: 0

Finance Automile, an Internet of Things company involved in field-service businesses, has received $34 million in Series B funding led by Insight Venture Partners, bringing its total funding to $47 million. Existing investors Dawn Capital, Point Nine Capital, SaaStr Fund, and Salesforce Ventures also participated in the new round. Automile will use the money on marketing, product developmen... » read more

MEMS Market Shifting
By Ed Sperling - 19 Oct, 2017 - Comments: 0

The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Oct, 2017 - Comments: 0

Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

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