tag: Qualcomm

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

The Week In Review: IoT
By Jeff Dorsch - 09 Sep, 2016 - Comments: 0

Analysis After reading a blog post touting the Internet of Things for home security, Jon Hedren wrote this post detailing how IoT-based home systems can be easily compromised and could fail in multiple ways. “The IoT ‘dream’ as sold by the industry is pretty cool, but it’s still just a dream. For now, these devices remain generally shoddy, insecure, and easily breakable—and must be t... » read more

The Week In Review: IoT
By Jeff Dorsch - 02 Sep, 2016 - Comments: 0

Analysis Cisco Systems and General Electric will be the main contenders in the industrial Internet of Things market, this analysis contends. Meanwhile, The New York Times analyzes GE’s big bet on the IoT and related software development to stay ahead of competing technology giants. Qualcomm holds the most Internet of Things patents, leading Intel, ZTE, Nokia, and LG Electronics, this anal... » read more

The Week in Review: IoT
By Jeff Dorsch - 19 Aug, 2016 - Comments: 1

Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

Preparing For 5G
By Jeff Dorsch - 09 Aug, 2016 - Comments: 0

If you like 4G LTE, you’re going to love 5G. The next-generation wireless communications technology will offer faster data transmission speeds and lower latency, providing the processing power to drive augmented-reality and virtual-reality applications for mobile devices and dedicated headsets. There is a caveat, though. The world needs to develop a consensus on what the 5G spectrum wil... » read more

Roots Of Distrust Spread
By Ed Sperling - 21 Jul, 2016 - Comments: 0

For most of the history of semiconductors there has been a persistent fear that someone would steal intellectual property from one company and sell it to another. There have been innumerable lawsuits involving corporate secrets that cross from one company to the next, and from one country to the next. The biggest concerns always were at the leading edges of technology, where those secrets w... » read more

5 Takeaways From Semicon
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

As usual, the recent Semicon West trade show was a busy, if not an overwhelming, event. The event, which took place in San Francisco in early July, featured presentations on the usual subjects in the semiconductor and IC-equipment sectors. There were sessions on 200mm, next-generation processes, transistors, lithography, MEMS and many others. In no particular order, here are my five ta... » read more

Waiting For 5G Technology
By Mark LaPedus - 23 Jun, 2016 - Comments: 1

For some time, carriers, equipment OEMs and chipmakers have been gearing up for the next-generation wireless standard called 5th generation mobile networks, or 5G. 5G is the follow-on to the current wireless standard known as 4G, or long-term evolution (LTE). It will enable data transmission rates of more than 10Gbps, or 100 times the throughput of LTE. But the big question is whether 5G wil... » read more

Plotting The Next Semiconductor Road Map
By Ed Sperling - 13 Jun, 2016 - Comments: 0

The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more

DAC Day Two: Down To Business
By Brian Bailey - 07 Jun, 2016 - Comments: 0

DAC day two started with a breakfast presentation put on by Synopsys which included guests from ARM, TSMC and HiSilicon. It was titled Collaborating to Enable Design with the latest processors and finFET processes. Collaboration is a word that we hear increasingly when talking about the advanced nodes and today we are truly at the point where one company cannot do it all. Ron Moore, VP of ma... » read more

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