tag: Qualcomm

Executive Insight: Lip-Bu Tan
By Ed Sperling - 06 Jun, 2016 - Comments: 0

Lip-Bu Tan, president and CEO of Cadence, opens up on the next big things, what will drive them, and what will change to make that happen. What follows are excerpts of that conversation. SE: What are the biggest changes in the semiconductor industry over the past year? Tan: The whole system approach to designing hardware and software is really happening now. It will continue to expand fr... » read more

The Numbers Game
By Jeff Dorsch - 02 Jun, 2016 - Comments: 1

Industry executives making presentations on the Internet of Things often cite the famous estimate by Cisco Systems – 25 billion connected devices in 2015 will double to 50 billion connected devices in 2020. Also, the worldwide IoT market will grow 21% a year to $7 trillion by the end of this decade, according to IDC. Billions and trillions are at stake. Many chip companies, especially I... » read more

Automating System Design
By Ann Mutschler - 02 May, 2016 - Comments: 1

Change is underway in the chip design world, creating opportunities and challenges that reach far beyond questions about whether Moore’s Law is slowing or stopping. Never before in the history of semiconductors has design been so complex and sophisticated, and never has it touched so many lives in so many interesting ways. This is all happening as a result of the chip’s enabling role in ... » read more

10nm Versus 7nm
By Mark LaPedus - 25 Apr, 2016 - Comments: 20

The silicon foundry business is heating up, as vendors continue to ramp their 16nm/14nm finFET processes. At the same time, they are racing each other to ship the next technologies on the roadmap—10nm and 7nm. But the landscape is complicated, with each vendor taking a different strategy. [getentity id="22865" e_name="Samsung"], for one, plans to ship its 10nm [getkc id="185" kc_name="fi... » read more

Cadence CDNLive Keynote Address: Thoughts and Implications
By Rich Wawrzyniak - 21 Apr, 2016 - Comments: 0

I attended the Cadence CDNLive conference at the Santa Clara Convention Center on April 5 and 6 and had a chance to listen to four very thought-provoking presentations given by the speakers. These presentations were combined to follow the keynote address given by Cadence CEO, Lip-Bu Tan and addressed several different aspects of the current semiconductor industry landscape. Speakers Lip-... » read more

Manufacturing Bits: April 12
By Mark LaPedus - 12 Apr, 2016 - Comments: 0

Ink FETs The University of Pennsylvania has developed a new way to make chips by using nanocrystal inks. The devices, dubbed nanocrystal field-effect transistors (FETs), could be used one day to develop chips for flexible and wearable applications In the lab, researchers devised spherical nanoscale particles. These particles, which have electrical characteristics, were dispersed in a liquid... » read more

Mobile Edge Computing For The IoE
By Ernest Worthman - 07 Apr, 2016 - Comments: 0

More attention is being focused on the edges of networks as the IoE begins taking hold. The reason is that the current wireless infrastructure is inadequate for handling the billions of endpoints that will make up the IoE. So for the IoE to realize its full potential, it will either require some sort of add-on infrastructure or a new discovery in physics. Edge networks were not always suc... » read more

A Formal Transformation
By Brian Bailey - 24 Mar, 2016 - Comments: 0

A very important change is underway in functional verification. In the past, this was an esoteric technology and one that was difficult to deploy. It was relegated to tough problems late in the verification cycle, and it was difficult to justify the ROI unless the technology actually did find some problems. But all of that has changed. Formal verification companies started to use the technology... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Feb, 2016 - Comments: 0

SUNY Polytechnic Institute (SUNY Poly) and GlobalFoundries announced the establishment of a new Advanced Patterning and Productivity Center (APPC). The $500 million, 5-year program will accelerate the introduction of extreme ultraviolet (EUV) lithography technologies into manufacturing. The center is located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y. -------... » read more

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