Manufacturing Bits: Jan. 18

By Mark LaPedus - 18 Jan, 2022 - Comments: 0

Proton/antiproton measurements CERN, the European Organization for Nuclear Research, has made a breakthrough in particle physics by conducting the world’s most precise measurements and comparisons between protons and antiprotons. The breakthrough can help scientists gain a better understand of particle physics as well as the origins and the composition of the universe. It can also bring n... » read more

Rightsizing Challenges Grow

By Ed Sperling - 20 Apr, 2016 - Comments: 0

Rightsizing chip architectures is getting much more complicated. There are more options to choose from, more potential bottlenecks, and many more choices about what process to use at what process node and for which markets and price points. Rightsizing is a way of targeting chips to specific application needs, supplying sufficient performance while minimizing power and cost. It has been a to... » read more

Manufacturing Bits: July 14

By Mark LaPedus - 14 Jul, 2015 - Comments: 0

Exploring the proton It took 23 years to conduct the experiments, but physicists have finally provided detailed results about the proton. The Deutsches Elektronen-Synchrotron (DESY) organization conducted the experiments within its particle accelerator from 1992 to 2007. The experiments took place in DESY’s Hadron Electron Ring Accelerator (HERA), an electron-proton collider. Then, ove... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Manufacturing Bits: Jan. 18

Rightsizing Challenges Grow

Manufacturing Bits: July 14

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