The Ten Commandments Of Packaging

By Sam Sadri - 19 Nov, 2020 - Comments: 0

Semiconductor packaging continues to evolve as chipmakers find new ways to fit more functionality into smaller spaces. Whereas the package once served primarily as a means of attaching a chip to a circuit board and protecting it from damage due to heat, moisture, etc., packaging today plays an important role in adding value to the device, boosting customization while helping to reduce costs. ... » read more

Defect Challenges Grow For IC Packaging

By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

Packaging Demands For RF And Microwave

By Ken Molitor - 22 Oct, 2020 - Comments: 0

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 09 Oct, 2020 - Comments: 1

Chipmakers and OEMs AMD is in talks to acquire Xilinx in a deal that could be worth more than $30 billion, according to a report from The Wall Street Journal. If the deal transpires, AMD will enter the FPGA business, putting it further in competition with Intel. No deal has been struck, though. --------------------------------------------- Multiple sources believe that China’s Huawei i... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 25 Sep, 2020 - Comments: 0

Top stories Here's the latest from Reuters: ''The United States has imposed restrictions on exports to China’s biggest chip maker SMIC after concluding there is an 'unacceptable risk' equipment supplied to it could be used for military purposes." What does this all mean? “The press has reported that on Friday, the U.S. Department of Commerce placed restrictions on China's largest semicondu... » read more

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The Ten Commandments Of Packaging

Defect Challenges Grow For IC Packaging

Packaging Demands For RF And Microwave

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test