Chip Industry Week In Review


Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

HBM4 Feeds Generative AI’s Hunger For More Memory Bandwidth


Generative AI (Gen AI), built on the exponential growth of Large Language Models (LLMs) and their kin, is one of today’s biggest drivers of computing technology. Leading-edge LLMs now exceed a trillion parameters and offer multimodal capabilities so they can take a broad range of inputs, whether they’re in the form of text, speech, images, video, code, and more, and generate an equally broa... » read more

Higher Density, More Data Create New Bottlenecks In AI Chips


Data movement is becoming a bigger problem at advanced nodes and in advanced packaging due to denser circuitry, more physical effects that can affect the integrity of signals or the devices themselves, and a significant increase in data from AI and machine learning. Just shrinking features in a design is no longer sufficient, given the scaling mismatch between SRAM-based L1 cache and digital... » read more

Chip Industry Week In Review


Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Navigating Complexity And Enhancing Security In Advanced Automotive Systems


As the automotive industry advances towards higher levels of Advanced Driver Assistance Systems (ADAS), the complexity of vehicles is growing at an unprecedented rate. Modern vehicles are equipped with an increasing array of ADAS sensors, sophisticated algorithms, powerful processors, advanced in-vehicle networks, and millions of lines of software code. These components are crucial for processi... » read more

DDR5 Client Chipset


This episode of Ask the Experts discusses DDR5 for client systems with John Eble, VP of Product Marketing, Memory Interface Chips at Rambus. Topics discussed include: The need for advanced chipsets for DDR5 client DIMMs The role of the DDR5 Client Clock Driver (CKD) and its use cases The AI applications driving the need for greater memory performance in client systems Find more... » read more

CPU Performance Bottlenecks Limit Parallel Processing Speedups


Multi-core processors theoretically can run many threads of code in parallel, but some categories of operation currently bog down attempts to raise overall performance by parallelizing computing. Is it time to have accelerators for running highly parallel code? Standard processors have many CPUs, so it follows that cache coherency and synchronization can involve thousands of cycles of low-le... » read more

Memory Implications Of Gen AI In Gaming


The global gaming market across hardware, software and services is on track to exceed annual revenues of $500B in 2025.1 That’s bigger by an order of magnitude than the combination of movies and music. On the cutting edge of that enormous market is open world gaming, where the driving goal is to give players the freedom to do anything they can imagine in a coherent and immersive environment. ... » read more

Power Delivery Challenged By Data Center Architectures


Processor and data center architectures are changing in response to the higher voltage needs of servers running AI and large language models (LLMs). At one time, servers drew a few hundred watts for operation. But over the past few decades that has changed drastically due to a massive increase in the amount of data that needs to be processed and user demands to do it more quickly. NVIDIA's G... » read more

Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

← Older posts Newer posts →