Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 Aug, 2018 - Comments: 0

Internet of Things Arm uncorked its first forward-looking CPU roadmap and performance numbers for client computing. The company said it expects to deliver annual performance improvements of more than 15% per year through 2020. The targeted market includes 5G, always-on, always-connected devices. C3 IoT will work with Google Cloud to support artificial intelligence and Internet of Things dep... » read more

Manufacturing Bits: Jan. 30

By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

A Brief History of Test

By Jeff Dorsch - 06 Mar, 2017 - Comments: 5

The history of semiconductor test systems is the subject of this blog post. We’ll turn to printed circuit board testing at another time. Boston-based Teradyne sold its D133 diode tester to Raytheon in 1961. Five years later, it introduced the J259 integrated circuit tester, which had a minicomputer to run the test programs. For many, this marks the beginning of automatic (or automated) tes... » read more

Manufacturing Bits: Jan. 3

By Mark LaPedus - 03 Jan, 2017 - Comments: 0

3D printed military drones The U.S. Army Research Laboratory has begun testing 3D printed drones for use in on-demand military missions. The technology, called the On-Demand Small Unmanned Aircraft System (ODSUAS), enables a soldier to input the mission requirements in software. Then, a 3D printer devises the optimal configuration for an unmanned aerial vehicle. And it’s printed and deliv... » read more

RF GaN Gains Steam

By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

Flexible Sensors Begin Ramping

By Jeff Dorsch - 07 Apr, 2016 - Comments: 0

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

Power/Performance Bits: April 1

By Ann Mutschler - 01 Apr, 2014 - Comments: 0

Heat-conducting polymer Polymer materials are usually thermal insulators but according to a team researchers including the Georgia Institute of Technology, University of Texas at Austin, and the Raytheon Company, by harnessing an electropolymerization process to produce aligned arrays of polymer nanofibers, they’ve developed a thermal interface material able to conduct heat 20 times better t... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer