Has 3D NAND Fallen Flat?

By Mark LaPedus - 17 Jul, 2014 - Comments: 0

Today’s planar NAND technology will hit the wall at 10nm, prompting the need for the next big thing in flash memory—3D NAND. In fact, 3D NAND may extend NAND flash memory for the next several years and enable new applications. And it will also drive a new wave of fabs and tool orders. But the transition won’t be as smooth as previous rollouts. 3D NAND is harder to manufacture than pr... » read more

Test Challenges Rising For Mobile Devices

By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

NAND ATE Market Gets Testy

By Mark LaPedus - 06 Feb, 2014 - Comments: 0

The NAND flash memory market is undergoing big changes. As planar NAND moves further down the 1xnm node regime, suppliers are ramping up devices with new cell structures, interfaces and other features. And on top of that, 3D NAND is beginning to appear in the market. The next-generation NAND devices will enable new applications in the mobile and enterprise markets, but the chips themselves p... » read more

The Week In Review: Aug. 19

By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

New Foundry Gold Rush: RF SOI

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus About every five years or so, a new and hot market emerges in the specialty foundry business that resembles a frenetic gold rush. The last big gold rush occurred around 2008, when more than a dozen foundries jumped into the bipolar-CMOS-DMOS (BCD) market to capitalize on the booming power-management sector. Now, the next gold rush is centering on an emerging technology—th... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: RBC Capital Markets

Has 3D NAND Fallen Flat?

Test Challenges Rising For Mobile Devices

NAND ATE Market Gets Testy

The Week In Review: Aug. 19

New Foundry Gold Rush: RF SOI