The Week In Review: Design

By Ann Mutschler - 22 Aug, 2014 - Comments: 0

Earnings Mentor Graphics reported revenues of $260.2 million, non-GAAP earnings per share of $0.23, and GAAP earnings per share of $0.13 for the company’s fiscal second quarter ended July 31. “System design strength, particularly with automotive customers, drove the second quarter with earnings solidly beating guidance,” said Walden C. Rhines, chairman and CEO of the company, in a stat... » read more

The Week In Review: System-Level Design

By Ed Sperling - 14 Feb, 2014 - Comments: 0

Cadence bought TranSwitch’s high-speed interface IP assets. TranSwitch, which made chips for communications equipment, filed for bankruptcy in November. (The company’s Web site is no longer active.) Cadence also won a deal with Microsoft, which will use Tensilica processors in the new Xbox One audio subsystem. And Cadence rolled out HiFi Audio Tunneling for Android, which takes advantage of... » read more

The Week In Review: Aug. 23

By Ed Sperling - 23 Aug, 2013 - Comments: 0

By Ed Sperling Cadence won a deal with Realtek, which licensed the Tensilica HiFi audio DSP core for voice recognition technology. Fast voice triggers have been possible for some time, but being able to combine that with low power for mobile devices isn’t easy because the devices are always on—or at least enough “on” to pick up voice commands. Mentor Graphics turned in a record-bre... » read more

The Week In Review: July 12

By Ed Sperling - 12 Jul, 2013 - Comments: 0

By Ed Sperling Cadence rolled a new version of its layout suite of tools for electrically aware designs, allowing design teams to check on electrical issues while the layout is being done. The company says this can reduce circuit design time by up to 30%, in addition to optimizing for performance and area. Cadence also announced a deal with Global Unichip, which successfully taped out a 20nm ... » read more

Deep Dive: Energy Efficient Ethernet

By Ed Sperling - 04 Nov, 2010 - Comments: 0

By Pallab Chatterjee In late September, the IEEE ratified the 802.3az Energy Efficient Ethernet (EEE) specification. The standard, and associated test certification specification, was supported by co-development of over 20 commercial products from multiple vendors, of which 13 were release to market simultaneous with the ratification. Wael Diab, from the office of the CTO at Broadcom, and ... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Realtek

The Week In Review: Design

The Week In Review: System-Level Design

The Week In Review: Aug. 23

The Week In Review: July 12

Deep Dive: Energy Efficient Ethernet