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Using Symbolic Simulation For SRAM Redundancy Repair Verification


Innovations in Very Deep Sub-Micron technologies, such as the advent of three-dimensional FinFET transistor structures, have facilitated the implementation of very large embedded SRAM memories in System-on-Chip (SoC) designs to the point where they occupy the majority of the chip die area. To get maximum memory capacity on the smallest die area, SRAM bitcells are designed with the minimum possi... » read more