Chip Industry Week In Review

By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

The Uncertainty Of Certifying AI For Automotive

By Ann Mutschler - 06 Jun, 2024 - Comments: 1

Nearly every new vehicle sold uses AI to make some decisions, but so far there is no consistency in what is being developed, where it is being used, and whether it is compatible with other vehicles on the road. This fragmentation is partially due to the fact that AI is still a nascent technology, and cars and trucks sold today may be significantly different than those that will be sold sever... » read more

Can Your Doorbell Be Spoofed?

By Palash Koutu - 06 Jun, 2024 - Comments: 0

Voice anti-spoofing is a set of techniques designed to prevent scam attempts that involve mimicked voices and improve the overall UI/UX experience of VUI systems by preventing accidental triggers. These techniques are particularly important to prevent issues related to: Speech Synthesis (SS): This type of attack employs a computer-simulated voice Voice Conversion (VC): In this attack,... » read more

Technology of the Connected Home and Building Delivers On Safety, Comfort and Convenience

By Renesas - 05 Jun, 2024 - Comments: 0

Devices for the home and office are increasingly differentiated by their intelligence and connectivity. Products that can sense their environment, detect users and other people, understand behavior, and respond in a way that humans find intuitive, provide higher value in the form of greater comfort, convenience and safety. This new generation of equipment for the smart home and building is made... » read more

Software-Defined Vehicle Momentum Grows

By Ann Mutschler - 09 May, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom

By Daryl Khoo - 09 May, 2024 - Comments: 0

The microcontroller sector is evolving in an exciting direction by providing designers with a growing menu of choices tailored to their performance and power requirements. Unlike the classic 1990s debate between the merits of x86 (CISC) and PowerPC (RISC) CPU architectures, there is plenty of room under the MCU tent for competing – and complementary – processor cores. The common denominator... » read more

Security For AI And AI For Security

By Renesas - 08 May, 2024 - Comments: 0

The aspect for AI was drastically changed after the introduction of ChatGPT from 2022. Even during 2010s, the question of whether the evolution of AI can overcome human’s logical thinking had been researched and developed (e.g., IBM Watson and Google AlphaGo). Now, a few years later from these results, everyone can experience the future potential of AI from the advent of generative AI. Major ... » read more

Chip Industry Week In Review

By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

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tag: Renesas

Chip Industry Week In Review

The Uncertainty Of Certifying AI For Automotive

Can Your Doorbell Be Spoofed?

Technology of the Connected Home and Building Delivers On Safety, Comfort and Convenience

Software-Defined Vehicle Momentum Grows

General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom

Security For AI And AI For Security

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

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