Software-Defined Vehicle Momentum Grows

By Ann Mutschler - 09 May, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom

By Daryl Khoo - 09 May, 2024 - Comments: 0

The microcontroller sector is evolving in an exciting direction by providing designers with a growing menu of choices tailored to their performance and power requirements. Unlike the classic 1990s debate between the merits of x86 (CISC) and PowerPC (RISC) CPU architectures, there is plenty of room under the MCU tent for competing – and complementary – processor cores. The common denominator... » read more

Security For AI And AI For Security

By Renesas - 08 May, 2024 - Comments: 0

The aspect for AI was drastically changed after the introduction of ChatGPT from 2022. Even during 2010s, the question of whether the evolution of AI can overcome human’s logical thinking had been researched and developed (e.g., IBM Watson and Google AlphaGo). Now, a few years later from these results, everyone can experience the future potential of AI from the advent of generative AI. Major ... » read more

Chip Industry Week In Review

By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review

By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

RISC-V Unleashes Your Imagination

By Giancarlo Parodi - 04 Apr, 2024 - Comments: 0

Since October 2020, Renesas has been officially active in the RISC-V microcontroller space and successfully launched two ASSP products, for motor control and voice-driven HMI systems. Now a general-purpose MCU enhances the RISC-V portfolio. It is the first MCU using a RISC-V core developed internally at Renesas. The R9A02G021 general-purpose microcontroller features an interesting mix of an... » read more

Ultimate Guide To Machine Learning For Embedded Systems

By Renesas - 03 Apr, 2024 - Comments: 0

Machine learning is a subfield of artificial intelligence which gives computers an ability to learn from data in an iterative manner using different techniques. Our aim here being to learn and predict from data. This is a big diversion from other fields which poses the limitation of programming instructions instead of learning from them. Machine learning in embedded systems specifically target ... » read more

Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review

By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys acquired Intrinsic ID, which develops physical unclonable func... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Renesas

Software-Defined Vehicle Momentum Grows

General-Purpose 32-bit RISC-V MCU Core Expands Design Freedom

Security For AI And AI For Security

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

RISC-V Unleashes Your Imagination

Ultimate Guide To Machine Learning For Embedded Systems

Chip Industry Week In Review

Chip Industry Week In Review