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Reliability, Machine Learning And Advanced Packaging


Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

Connecting The Car


K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more