Power Issues Causing More Respins At 7nm And Below

By Brian Bailey - 26 Jan, 2023 - Comments: 0

Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

IP’s Growing Impact On Yield And Reliability

By Ann Mutschler - 04 Sep, 2019 - Comments: 0

Chipmakers are finding it increasingly difficult to achieve first-pass silicon with design IP sourced internally and from different IP providers, and especially with configurable IP. Utilizing poorly qualified IP and waiting for issues to appear during the design-to-verification phase just before tape-out can pose high risks for design houses and foundries alike in terms of cost and time to... » read more

Building An Efficient Inferencing Engine In A Car

By Ed Sperling - 05 Jun, 2019 - Comments: 0

David Fritz, who heads corporate strategic alliances at Mentor, a Siemens Business, talks about how to speed up inferencing by taking the input from sensors and quickly classifying the output, but also doing that with low power. » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: respins

Power Issues Causing More Respins At 7nm And Below

IP’s Growing Impact On Yield And Reliability

Building An Efficient Inferencing Engine In A Car

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