Power Issues Causing More Respins At 7nm And Below

By Brian Bailey - 26 Jan, 2023 - Comments: 0

Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

IP’s Growing Impact On Yield And Reliability

By Ann Mutschler - 04 Sep, 2019 - Comments: 0

Chipmakers are finding it increasingly difficult to achieve first-pass silicon with design IP sourced internally and from different IP providers, and especially with configurable IP. Utilizing poorly qualified IP and waiting for issues to appear during the design-to-verification phase just before tape-out can pose high risks for design houses and foundries alike in terms of cost and time to... » read more

Building An Efficient Inferencing Engine In A Car

By Ed Sperling - 05 Jun, 2019 - Comments: 0

David Fritz, who heads corporate strategic alliances at Mentor, a Siemens Business, talks about how to speed up inferencing by taking the input from sensors and quickly classifying the output, but also doing that with low power. » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

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by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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Megafabs churning out the most advanced processors are not the only game in town.

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tag: respins

Power Issues Causing More Respins At 7nm And Below

IP’s Growing Impact On Yield And Reliability

Building An Efficient Inferencing Engine In A Car