Over 50% Of Smart Phones And Tablets Leverage SOI

By Various Writers - 18 Mar, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ In a recent press release, the SOI wafer leader Soitec said that chips built on its SOI wafers were found in over half of the smartphones and tablets in the market worldwide. 50%? That’s a lot! How do they figure that? The answer: RF. [caption id="attachment_809" align="alignleft" width="549" caption="As seen here... » read more

SOI Highlights at Common Platform Tech Forum

By Various Writers - 19 Feb, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

Smartphones Dial Up New RF Processes

By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

Wafer Leaders Extend Basis for Global SOI Supply

By Various Writers - 16 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE ;1-4 OCT, NAPA

By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

Foundries Going Greener

By Ed Sperling - 26 Jun, 2012 - Comments: 0

The ongoing push towards green and energy-efficient systems is prompting the silicon foundries to jump on the bandwagon and devise their next-generation processes based on ultra-high voltage technology. For some time, several foundries have offered 1- and 0.5-micron, ultra-high voltage processes with ratings up to 800 volts. But seeking to get a jump for the next wave of designs, the special... » read more

RF, MEMS, Photonics Driving 3D Stacking

By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Pallab Chatterjee At Semicon West, a number of the key speakers and TechXPOTs were talking about current products being assembled and shipped with 3D technology. 3D die stacking is no longer a technology of the future. In fact it has been here for many years and has been used in millions, if not billions, of consumer, commercial and high-reliability designs. The two leading technologies ... » read more

RF Substrate Technologies for Mobile Communications

By Various Writers - 23 May, 2011 - Comments: 0

Two Soitec Group managers -- Eric Desbonnets and Stéphane Laurent -- describe how SOI wafers support RF technology development. » read more

Your Light Bulb Is Calling

By Ed Sperling - 25 Feb, 2010 - Comments: 0

By Pallab Chatterjee The mobility that is best associated with “smart phone” functionality is making its way into most other electronic systems. At ISSCC and even the Strategies in Light conference, systems and products were being shown featuring standard RF interfaces. The RF is being made available as standalone die for multi-die and 3D packaging, as well as in SoC IP blocks. The func... » read more

Low-Power And RF Design Heighten Signal-Integrity Concerns

By Various Writers - 28 Jan, 2010 - Comments: 0

By Ellen Konieczny As active devices and interconnect wires shrink and are placed closer together with the march of Moore’s Law, signal integrity is becoming a huge concern. If it is not maintained, a design’s future may be marred by lower yields, unreliable performance, and failure to work efficiently—if at all. For low-power and radio-frequency (RF) designs, which are being prod... » read more

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