tag: RF

Rapid Distortion Analysis For Intercept Point Calculations
By Various Writers - 29 Jan, 2014 - Comments: 0

Distortion effects have an important impact on the performance of RF circuits, including mixers, low-noise amplifiers (LNAs) and power amplifiers (PAs). At high frequencies, particularly with narrowband circuits, it is common to characterize the distortion produced by circuit nonlinearities in terms of an intercept point (IPn). Under small signal input conditions, from where intercept points ar... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

Over 65% Smartphone RF Switches SOI, Says Yole; Power Amps Next
By Various Writers - 14 Aug, 2013 - Comments: 0

By Adele Hars The industry research firm Yole Développement says that more than 65 percent of substrates used in fabricating switches for handsets are SOI-based. This is a high-growth part of the market, putting up double-digit increases. Like a standard SOI wafer, an RF SOI substrate has an active (“top”) layer on which CMOS transistors are built, with an isolating (“BOx”) ... » read more

VLSI Kyoto – The SOI Papers
By Various Writers - 19 Jun, 2013 - Comments: 0

By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions.  The papers should all b... » read more

CMOS And SOI Invade RF Front End
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but arguably the most critical part in a handset—the radio-frequency (RF) front-end. Typically, the RF front-end often comes in a module and includes various key components, such ... » read more

Over 50% Of Smart Phones And Tablets Leverage SOI
By Various Writers - 18 Mar, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In a recent press release, the SOI wafer leader Soitec said that chips built on its SOI wafers were found in over half of the smartphones and tablets in the market worldwide. 50%? That’s a lot! How do they figure that? The answer: RF. [caption id="attachment_809" align="alignleft" width="549" caption="As seen here... » read more

SOI Highlights at Common Platform Tech Forum
By Various Writers - 19 Feb, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

Smartphones Dial Up New RF Processes
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

Wafer Leaders Extend Basis for Global SOI Supply
By Various Writers - 16 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA
By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

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