Foundries Going Greener


The ongoing push towards green and energy-efficient systems is prompting the silicon foundries to jump on the bandwagon and devise their next-generation processes based on ultra-high voltage technology. For some time, several foundries have offered 1- and 0.5-micron, ultra-high voltage processes with ratings up to 800 volts. But seeking to get a jump for the next wave of designs, the special... » read more

RF, MEMS, Photonics Driving 3D Stacking


By Pallab Chatterjee At Semicon West, a number of the key speakers and TechXPOTs were talking about current products being assembled and shipped with 3D technology. 3D die stacking is no longer a technology of the future. In fact it has been here for many years and has been used in millions, if not billions, of consumer, commercial and high-reliability designs. The two leading technologies ... » read more

RF Substrate Technologies for Mobile Communications


Two Soitec Group managers -- Eric Desbonnets and Stéphane Laurent -- describe how SOI wafers support RF technology development. » read more

Your Light Bulb Is Calling


By Pallab Chatterjee The mobility that is best associated with “smart phone” functionality is making its way into most other electronic systems. At ISSCC and even the Strategies in Light conference, systems and products were being shown featuring standard RF interfaces. The RF is being made available as standalone die for multi-die and 3D packaging, as well as in SoC IP blocks. The func... » read more

Low-Power And RF Design Heighten Signal-Integrity Concerns


By Ellen Konieczny As active devices and interconnect wires shrink and are placed closer together with the march of Moore’s Law, signal integrity is becoming a huge concern. If it is not maintained, a design’s future may be marred by lower yields, unreliable performance, and failure to work efficiently—if at all. For low-power and radio-frequency (RF) designs, which are being prod... » read more

Pulling Power Out Of Thin Air


By Cheryl Ajluni It wasn’t all that long ago that voice communication via a traditional landline was the norm. At the time, consumers would have been hard pressed to imagine a world in which anytime, anywhere communication (voice and data) with a device no bigger than the human hand was possible. Many of those same consumers might today find it hard to conceive of a world in which their... » read more

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