Manufacturing Bits: Oct. 9

By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Power/Performance Bits: July 3

By Jesse Allen - 03 Jul, 2019 - Comments: 0

2D straintronics Researchers at the University of Rochester and Xi’an Jiaotong University dug into how 2D materials behave when stretched to push the boundaries of what they can do. "We're opening up a new direction of study," says Stephen Wu, assistant professor of electrical and computer engineering and physics at Rochester. "There's a huge number of 2D materials with different properti... » read more

Power/Performance Bits: June 25

By Jesse Allen - 25 Jun, 2019 - Comments: 0

Improving IGBTs Researchers at the University of Tokyo developed a power switching device that surpasses previous performance limits, showing that there may still be gains ahead for the silicon-based devices, which have been thought to be approaching their limits. The team's improved insulated gate bipolar transistor (IGBT) used a scaling approach, and simulations showed that downscaling pa... » read more

Power/Performance Bits: June 4

By Jesse Allen - 04 Jun, 2019 - Comments: 0

Flexible high-temp dielectric Researchers at Rice University, Georgia Institute of Technology, and Cornell University developed a new high-temperature dielectric nanocomposite for flexible electronics, energy storage, and electric devices that combines one-dimensional polymer nanofibers and two-dimensional boron nitride nanosheets. The polymer nanofibers act as a structural reinforcement, w... » read more

System Bits: April 16

By Jeff Dorsch - 16 Apr, 2019 - Comments: 0

Characterizing 2D borophene Researchers at Rice and Northwestern universities collaborated on a method to view the polymorphs of 2D borophene crystals, providing insights into the lattice configurations of the two-dimensional material. Boris Yakobson, a materials physicist at Rice’s Brown School of Engineering, and materials scientist Mark Hersam of Northwestern led a team that not only d... » read more

Manufacturing Bits: Feb. 26

By Mark LaPedus - 26 Feb, 2019 - Comments: 0

Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

System Bits: Feb. 26

By Jeff Dorsch - 26 Feb, 2019 - Comments: 0

Firefly microstructures in LED light bulbs Pennsylvania State University researchers wanted to improve the energy efficiency of commercial light-emitting diode light bulbs to save even more energy. They found the answer in the lantern surface of fireflies. "LED lightbulbs play a key role in clean energy," said Stuart (Shizhuo) Yin, professor of electrical engineering at Penn State. "Overall... » read more

System Bits: Jan. 22

By Jeff Dorsch - 22 Jan, 2019 - Comments: 0

Toward more trusted microelectronics David Crandall, an associate professor in Indiana University Bloomington’s School of Informatics, Computing and Engineering, is collaborating with other researchers through the Indiana Innovation Institute (IN3) to work on technology challenges for private industry and the U.S. Department of Defense. Crandall is currently tackling trusted microelectron... » read more

Power/Performance Bits: Jan. 8

By Jesse Allen - 08 Jan, 2019 - Comments: 0

Ferrimagnetic memory Engineers at the National University of Singapore, Toyota Technological Institute, and Korea University propose a new type of spintronic memory that is 20 times more efficient and 10 times more stable than commercial ones. In spintronic devices, data is stored depending on up or down magnetic states. Current devices based on ferromagnets, however, suffer from a few issu... » read more

Power/Performance Bits: Nov. 27

By Jesse Allen - 27 Nov, 2018 - Comments: 0

Hybrid solar for hydrogen and electricity Researchers at the Lawrence Berkeley National Laboratory developed an artificial photosynthesis solar cell capable of both storing the sun's energy as hydrogen through water splitting and outputting electricity directly. The hybrid photoelectrochemical and voltaic (HPEV) cell gets around a limitation of other water splitting devices that shortchange... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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