2D Materials Roadmap: Current And Future Challenges, Solutions


A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Neuromorphic Computing: Challenges, Opportunities Including Materials, Algorithms, Devices & Ethics


This new research paper titled "2022 roadmap on neuromorphic computing and engineering" is from numerous researchers at Technical University of Denmark, Instituto de Microelectrónica de Sevilla, CSIC, University of Seville, and many others. Partial Abstract: "The aim of this roadmap is to present a snapshot of the present state of neuromorphic technology and provide an opinion on the chall... » read more

Imec’s Plan For Continued Scaling


At IEDM in December, the opening keynote (technically "Plenary 1") was by Sri Samevadam of Imec. His presentation was titled "Towards Atomic Channels and Deconstructed Chips." He presented Imec's view of the future of semiconductors going forward, both Moore's Law (scaling) and More than Moore (advanced packaging and multiple die). It is always interesting to hear Imec's view of the world sinc... » read more