Will 7nm And 5nm Really Happen?

By Mark LaPedus - 14 Jul, 2014 - Comments: 2

Today’s silicon-based finFETs could run out of steam at 10nm. If or when chipmakers move beyond 10nm, IC vendors will require a new transistor architecture. III-V finFETs, gate-all-around FETs, quantum well finFETs, SOI finFETs and vertical nanowires are just a few of the future transistor candidates at 7nm and 5nm. Technically, it’s possible to manufacture the transistor portions of the... » read more

Interconnect Challenges Grow

By Mark LaPedus - 20 Feb, 2014 - Comments: 0

Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance and cost. Another concern for Qualcomm is an often-overlooked part of the equation—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within ... » read more

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Will 7nm And 5nm Really Happen?

Interconnect Challenges Grow

Trending Articles

Shift Left Is The Tip Of The Iceberg

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

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Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

NAND Flash Targets 1,000 Layers

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

Why Small Fab And Assembly Houses Are Thriving

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tag: ruthenium

Will 7nm And 5nm Really Happen?

Interconnect Challenges Grow

Trending Articles

Shift Left Is The Tip Of The Iceberg

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

NAND Flash Targets 1,000 Layers

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

Why Small Fab And Assembly Houses Are Thriving

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