Safeguarding Automotive Electronics

By Thierry Kouthon - 03 Dec, 2020 - Comments: 0

Modern automobiles can have up to 100 Electronic Control Units (ECUs) depending on their class, make, and model, with the number of ECUs rising even higher in the case of electric vehicles. An ECU is an embedded system in the car’s electronics. They are used to control all the vehicle's functions, including engine, powertrain, transmission, brakes, suspension, dashboard, entertainment system ... » read more

Growing Complexity Adds To Auto IC Safety Challenges

By Ann Mutschler - 05 Nov, 2020 - Comments: 0

The automotive industry is working to streamline, automate and tame verification of automotive electronic control units, SoCs and other chips used in vehicles, many of which are becoming so complex and intertwined that progress is getting bogged down. Modern cars may have up to 100 ECUs, which control such vehicle functions as engine, powertrain, transmission, brakes, suspension, entertainme... » read more

All Security Issues Are Safety Issues

By Aileen Ryan - 25 Apr, 2019 - Comments: 0

Last month I spoke at the IQPC Safety and Security week event in Munich. It became clear to me that our semiconductor community is really paying attention to these issues now, not just to comply with standards, and not just because of the potential liability – but because it simply makes good business sense. The cost of recalling a single vehicle is estimated to be between $400 and $900 ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SAE J3061

Safeguarding Automotive Electronics

Growing Complexity Adds To Auto IC Safety Challenges

All Security Issues Are Safety Issues