tag: Samsung Semiconductor

Yield Management Embraces Expanding Role
By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Ruthenium Interconnects On Tap
By Katherine Derbyshire - 20 Jun, 2024 - Comments: 0

Chipmakers' focus on new interconnect technology is ramping up as copper's effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat at future nodes and in advanced packages. The introduction of copper interconnects in 1997 upended the then-standard tungsten via/aluminum line metallization scheme. Dual damascene integration ... » read more

Chip Industry Week In Review
By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan.  China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

DAC/SEMICON West 2023 Roundup
By The SE Staff - 17 Jul, 2023 - Comments: 0

The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year's SEMICON West, both in presentations and one-on-one discussions. Challenges range from sharing data securely across a highly integrated supply chain, particularly in light of heterogeneous integration, security concerns, and the increased use of AI, as well as concerns about the robus... » read more

Breaking The 1M RAID5 Write IOPS Barrier
By Samsung - 17 May, 2023 - Comments: 0

In today’s data-centric age, enormous amounts of data are generated, stored and processed at an unprecedented rate. Businesses are utilizing this data to make better decisions, drive greater efficiencies, develop more desirable products, improve profitability and ultimately increase user satisfaction. To continue deriving a high degree of value from a rapidly-expanding data flow, today’s en... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 31 Mar, 2023 - Comments: 0

The U.S. Commerce Department outlined proposed rules for the Chips for America Incentives Program, including additional details on national security measures applicable to the CHIPS Incentives Program included in the CHIPS and Science Act. The rules limit funding recipients from investing in the expansion of semiconductor manufacturing in foreign countries of concern, notably the People’s Rep... » read more

Week In Review: Design, Low Power
By Susan Rambo - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Improving Performance And Power With HBM3
By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

DeepGBASS: Deep Guided Boundary-Aware Semantic Segmentation
By Samsung - 18 Jan, 2023 - Comments: 0

Image semantic segmentation is ubiquitously used in scene understanding applications, such as AI Camera, which require high accuracy and efficiency. Deep learning has significantly advanced the state-of-the-art in semantic segmentation. However, many of recent semantic segmentation works only consider class accuracy and ignore the accuracies at the boundaries between semantic classes. To improv... » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

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