tag: Samsung

Fan-Out Packaging Gets Competitive
By Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Week In Review, Design, Low Power
By Marie C. Baca - 29 Jul, 2022 - Comments: 0

Financial News Cadence announced second quarter revenue of $858 million, an increase of 17.9% compared with the same period a year ago when revenue was $728 million. President and CEO Anirudh Devgan said the company’s results are “emblematic of the megatrends of the long-term strength of semis, systems companies investing more in silicon, and the convergence of system and chip designs.�... » read more

Fab Investments Head Toward Record High
By Marie C. Baca - 27 Jul, 2022 - Comments: 0

Corporations and governments around the globe are making record-breaking investments in chip manufacturing plants amid a major push to make the semiconductor supply chain more robust and less prone to shortages caused by everything from market variations to geopolitical interruptions. These investments — which range from updating existing fabrication facilities to building entirely new fab... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 22 Jul, 2022 - Comments: 0

Ramping capacity Samsung is considering building as many as 11 fabs in central Texas, investing an estimated $200 billion and creating as many as 10,000 jobs. The plans came to light when the company filed paperwork for tax breaks. Samsung already has broken ground on a new $17 billion fab in Taylor, Texas. The remaining nine fabs, including two in nearby Austin, would be built over the next c... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Film Failure in Multilayer Systems for Semiconductor Devices
By Technical Paper Link - 18 Jul, 2022 - Comments: 0

Researchers at MIT, Yonsei University (Seoul, Korea) just published this technical paper titled "Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices." According to the abstract "In this work, the effect of thermomechanical stress on the failure of multilayered thin films on Si substrates was studied using analytical calculations and various thermomechanical tests." ... » read more

Week In Review, Manufacturing, Test
By SE Staff - 08 Jul, 2022 - Comments: 0

The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Jul, 2022 - Comments: 0

Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

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