Chip Industry Week In Review

By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Gearing Up For Hybrid Bonding

By Laura Peters - 23 Oct, 2023 - Comments: 2

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets vertically in direct wafer-to-wafer bonds, chipmakers can leapfrog attainable interconnection pitch from 35µm in copper micro-bumps to 10µm or less. That reduces signal delay to negligible levels and e... » read more

Chip Industry Talent Shortage Drives Academic Partnerships

By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Chip Industry Week In Review

By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Everyone’s A System Designer With Heterogeneous Integration

By Ann Mutschler - 02 Oct, 2023 - Comments: 0

The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by engineers at every step of the flow, from design through manufacturing. Nearly every engineer is now working or touching some technology, process, or methodology that is new. And they are inter... » read more

Chip Industry Week In Review

By The SE Staff - 22 Sep, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan The U.S. Department of Defense (DOD) announced $238 million in awards toward establishing eight regional innovation hubs under the CHIPS and Science Act. The hubs aim to accelerate hardware prototyping and "lab-to-fab" transition of semiconductor technologies for secure edge/IoT, 5G/6G, AI hardware, quantum technology, electromagnetic warfare, and ... » read more

Sweeping Changes For Leading-Edge Chip Architectures

By Ed Sperling - 08 Sep, 2023 - Comments: 0

Chipmakers are utilizing both evolutionary and revolutionary technologies to achieve orders of magnitude improvements in performance at the same or lower power, signaling a fundamental shift from manufacturing-driven designs to those driven by semiconductor architects. In the past, most chips contained one or two leading-edge technologies, mostly to keep pace with the expected improvements i... » read more

Week In Review: Manufacturing, Test

By Gregory Haley - 01 Sep, 2023 - Comments: 0

Bosch completed its acquisition of TSI Semiconductors to expand its SiC chips business, reports Reuters. In April, Bosch announced plans to invest $1.5 billion in the Roseville, California, foundry to convert TSI’s manufacturing facilities into state-of-the-art processes, with the first SiC chips due out in 2026. Bosch CEO Stefan Hartung said the full expansion "depends on the support of the... » read more

Week In Review: Design, Low Power

By Linda Christensen - 25 Aug, 2023 - Comments: 0

Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

Week In Review: Automotive, Security and Pervasive Computing

By Linda Christensen - 18 Aug, 2023 - Comments: 0

The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

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tag: Samsung

Chip Industry Week In Review

Gearing Up For Hybrid Bonding

Chip Industry Talent Shortage Drives Academic Partnerships

Chip Industry Week In Review

Everyone’s A System Designer With Heterogeneous Integration

Chip Industry Week In Review

Sweeping Changes For Leading-Edge Chip Architectures

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Automotive, Security and Pervasive Computing

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