System Bits: June 14

By Ann Mutschler - 14 Jun, 2016 - Comments: 0

Microlaser phase locking arrays for terahertz security scanners Researchers at MIT and Sandia National Laboratories reminded that terahertz radiation, the band of electromagnetic radiation between microwaves and visible light, has promising applications in security and medical diagnostics, even if such devices will require the development of compact, low-power, high-quality terahertz lasers. ... » read more

Power/Performance Bits: June 7

By Jesse Allen - 07 Jun, 2016 - Comments: 0

Tiny lasers on silicon A group of scientists from Hong Kong University of Science and Technology, the University of California, Santa Barbara, Sandia National Laboratories, and Harvard University were able to fabricate tiny lasers directly on silicon. To do this, they first had to resolve silicon crystal lattice defects to a point where the cavities were essentially equivalent to those gr... » read more

Power/Performance Bits: May 24

By Jesse Allen - 24 May, 2016 - Comments: 0

Reducing MRAM chip area Researchers from Tohoku University developed a technology to stack magnetic tunnel junctions (MTJ) directly on the via without causing deterioration to its electric/magnetic characteristics. The team focused on reducing the memory cell area of spin-transfer torque magnetic random access memory (STT-MRAM) in order to lower manufacturing costs, making them more compe... » read more

Power/Performance Bits: June 17

By Ann Mutschler - 17 Jun, 2014 - Comments: 0

Nanotubes boost terahertz detectors Researchers at Rice University, Sandia National Laboratories and the Tokyo Institute of Technology have developed novel terahertz detectors based on carbon nanotubes that could improve medical imaging, airport passenger screening, food inspection and other applications. Unlike current terahertz detectors, the devices are flexible, sensitive to polarizatio... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Sandia National Laboratories

System Bits: June 14

Power/Performance Bits: June 7

Power/Performance Bits: May 24

Power/Performance Bits: June 17

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Knowledge Centers
Entities, people and technologies explored