tag: self-heating

Memory On Logic: The Good And Bad
By Brian Bailey - 11 Apr, 2024 - Comments: 0

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on top of logic. Memory on logic significantly reduces the distance between logic and directly associated memory. This can increase performance by 22% and reduce power by 36%, according to one re... » read more

Characterization, Modeling, And Model Parameter Extraction Of 5nm FinFETs
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “A Comprehensive RF Characterization and Modeling Methodology for the 5nm Technology Node FinFETs” was published by researchers at IIT Kanpur, MaxLinear Inc., and University of California Berkeley. Abstract: "This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry stan... » read more

Extreme Fast Charging by Regulating Lithium-Ion Batteries’ Self-Generated Heat Via Active Thermal Switching
By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Extreme fast charging of commercial Li-ion batteries via combined thermal switching and self-heating approaches” was published by researchers at Lawrence Berkeley National Laboratory, the University of California, Berkeley, and the Hong Kong University of Science and Technology. Abstract: "The mass adoption of electric vehicles is hindered by the inadequate ext... » read more

Design For Reliability
By Brian Bailey - 15 Feb, 2021 - Comments: 1

Circuit aging is emerging as a mandatory design concern across a swath of end markets, particularly in markets where advanced-node chips are expected to last for more than a few years. Some chipmakers view this as a competitive opportunity, but others are unsure we fully understand how those devices will age. Aging is the latest in a long list of issues being pushed further left in the desig... » read more

Rising Packaging Complexity
By Ed Sperling - 19 May, 2020 - Comments: 1

Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow. » read more

How Chips Age
By Ed Sperling - 20 Jan, 2020 - Comments: 1

Andre Lange, group manager for quality and reliability at Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about circuit aging, whether current methods of predicting reliability are accurate for chips developed at advanced process nodes, and where additional research is needed. » read more

Analog: Avoid Or Embrace?
By Brian Bailey - 16 Jan, 2020 - Comments: 0

We live in an analog world, but digital processing has proven quicker, cheaper and easier. Moving digital data around is only possible while the physics of wires can be safely abstracted away enough to provide reliable communications. As soon as a signal passes off-chip, the analog domain reasserts control for modern systems. Each of those transitions requires a data converter. The usage ... » read more

Chip Aging Becomes Design Problem
By Brian Bailey - 09 Aug, 2018 - Comments: 9

Chip aging is a growing problem at advanced nodes, but so far most design teams have not had to deal with it. That will change significantly as new reliability requirements roll out across markets such as automotive, which require a complete analysis of factors that affect aging. Understanding the underlying physics is critical, because it can lead to unexpected results and vulnerabilities. ... » read more

Early Chip-Package-System Thermal Analysis
By Annapoorna Krishnaswamy - 10 May, 2018 - Comments: 0

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems
By Annapoorna Krishnaswamy - 12 Mar, 2018 - Comments: 0

The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

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