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Rising Packaging Complexity

Why advanced packaging is still so difficult.

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Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow.



1 comments

CHARLES NOLAN says:

US Patent 4,845,426 environmental temperature control allowing full parametric testing at wafer to provide known good die for building the ring processor or your modules.

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