Estimating MOSFET Leakage From Low-Cost, Low-Resolution Fast Parametric Test


A method of estimating the subthershold component of MOSFET off-state current (Ioffs) using low-cost, low-resolution fast parallel parametric test is introduced. This method measures the subthreshold slope and uses it to estimate Ioffs. Measurements of individual transistors show a very good agreement between measured Ioffs and Ioffs estimated using our approach. For a simple pad-efficient tran... » read more

Defect Reduction At 7/5nm


Darin Collins, director of metrology at Brewer Science, talks about the cause of defects at advanced nodes and how material purity increasingly plays a role in overall quality and yield. » read more

Dealing With Resistance In Chips


Chipmakers continue to scale the transistor at advanced nodes, but they are struggling to maintain the same pace with the other two critical parts of the device—the contacts and interconnects. That’s beginning to change, however. In fact, at 10nm/7nm, chipmakers are introducing new topologies and materials such as cobalt, which promises to boost the performance and reduce unwanted resist... » read more

Advanced 3D Design Technology Co-Optimization For Manufacturability


By Yu De Chen, Jacky Huang, Dalong Zhao, Jiangjiang (Jimmy) Gu, and Joseph Ervin Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device structures and the increasing complexity of process innovations introduced to achieve improved product performanc... » read more

The Next 5 Years Of Chip Technology


Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational litho products at ASML; and Shay... » read more

7/5nm Timing Closure Intensifies


Timing closure issues are increasing in magnitude at 7/5nm, and ones that were often considered minor in the past no longer can be ignored. Timing closure is an essential part of any chip design. The process ensures that all combinatorial paths through a design meet the necessary timing so that it can run reliably at a specified clock rate. Timing closure hasn't changed significantly over th... » read more

Pattern-Based Analytics To Estimate And Track Yield Risk Of Designs Down To 7nm


Topological pattern-based methods for analyzing IC physical design complexity and scoring resulting patterns to identify risky patterns have emerged as powerful tools for identifying important trends and comparing different designs. In this paper, previous work is extended to include analysis of layouts designed for the 7nm technology generation. A comparison of pattern complexity trends with r... » read more

E-beam Inspection Makes Inroads


E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI and others are developing new e-beam inspection tools and/or techniques to solve some of the more difficult defect issues in the fab. [gettech id="31057" t_name="E-beam"] inspection is one of tw... » read more

Methodology For Analyzing And Quantifying Design Style Changes And Complexity Using Topological Patterns


In order to maximize yield, IC design companies spend a lot of effort to analyze what types of design styles are needed and used in their layouts (standard cells, macros, routing layers, and so forth). This paper introduces a novel methodology for full chip high performance topological pattern analysis and the applications of this methodology towards analyzing design styles in order to quanti... » read more

How To Sleep Easier If You Test Auto ICs For A Living


Last month, I looked at the product definition process of automotive ICs, using the $7 billion microcontroller market as an illustration of design exploration to optimize performance, features, die size and product cost. Now I’d like to look at the back end of the process — the final IC testing that’s still critical no matter how sound the upfront work in defining a featuring set and aptl... » read more

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