The Race To Much More Advanced Packaging


Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Semiconductor Memory Evolution And Current Challenges


The very first all-electronic memory was the Williams-Kilburn tube, developed in 1947 at Manchester University. It used a cathode ray tube to store bits as dots on the screen’s surface. The evolution of computer memory since that time has included numerous magnetic memory systems, such as magnetic drum memory, magnetic core memory, magnetic tape drive, and magnetic bubble memory. Since the 19... » read more

How To Improve DPPM By 10X Without Affecting Yield


Chips today are under immense pressure. With wider process variation manifested at wafer and die levels in single-digit nodes, highly complex designs, and effects of application and system integration, it’s no wonder the electronics value chain is becoming ever more reliant on expensive guard-bands. The ecosystem is not yet equipped to find all existing defects during test. So while quality e... » read more

Cleaning Data For Final Test


John O’Donnell, CEO of yieldHUB, talks about why data integrity is so critical for final test, what can cause it to be less-than-perfect, what’s needed to improve the quality of that data, and how that impacts the overall yield in a fab. » read more

Rising Packaging Complexity


Synopsys’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow. » read more

Holistic Yield Improvement Methodology


As new products and processes are being introduced into IC manufacturing at an accelerated rate, yield learning and ramping are becoming more challenging due to the increased interaction between the design and process. Compared to random defect caused yield losses, systematic yield loss mechanisms are becoming more important, thus initial yield ramping process becomes more challenging. A “hol... » read more

What’s WAT? Testing At The End Of Manufacturing


The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their area of expertise. On the other hand, the fabless company relies on the expertise and skills of the foundry to produce quality wafers. Many times a process used by a fabless company to manufacture... » read more

Wafer Test Challenges For Chiplets


In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage. From a test perspective, making chiplets a mainstream technology depends on ensuring Good Enough Die at a reasonable test cost. Wafer-level test plays a critical and intricate role in the chipl... » read more

Chiplet Momentum Rising


The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Scaling, Packaging, And Partitioning


Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

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