Scaling, Packaging, And Partitioning


Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

A Holistic Approach To Yield Management


At yieldHUB we work with consultants and semiconductor experts, like André van de Geijn, semiconductor expert and author of Collaboratism. He supports our customers on the west coast of the US. We asked him about the benefits of various yield management solutions (YMS). In this article we will explain the benefits with insights from André. Today, people look at their current problem an... » read more

Die-To-Die Connectivity


Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

The Challenge Of Defining Worst Case


Worst case conditions within a chip are impossible to define. But what happens if you missed a corner case that causes chip failure? As the semiconductor market becomes increasingly competitive — startups and systems companies are now competing with established chipmakers — no one can afford to consider theoretical worst cases. Instead, they must intelligently prune the space to make sur... » read more

Power Semi Wars Begin


Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Curvilinear Full-Chip ILT


Leo Pang, chief product officer and executive vice president at D2S, talks about the speed improvements with full-chip inverse lithography technology, why it is so critical in stitching together large chips, and how this approach differs from traditional litho approaches. » read more

Reducing Costly Flaws In Heterogeneous Designs


The cost of defects is rising as chipmakers begin adding multiple chips into a package, or multiple processor cores and memories on the same die. Put simply, one bad wire can spoil an entire system. Two main issues need to be solved to reduce the number of defects. The first is identifying the actual defect, which becomes more difficult as chips grow larger and more complex, and whenever chi... » read more

The Unexpected Impact Of Lots On Hold


One of the biggest bottlenecks in any Subcon is Lots on Hold. The problem occurs many times a week on most factory floors. It’s something you’ve grown to loathe or endure. But, is there something you can do to reduce the amount of time lots spend on hold? In this article, we will explain what Lots on Hold are and how you can make the process less painful for your team and help improve on-ti... » read more

The Hidden Potential Of Test Engineers


Design engineers are seen as the cornerstone of new projects in many semiconductor companies, working away with the team to design the next product and making sure it meets all specifications. We pay little thought to the test engineer, who works in the shadows designing algorithms, hardware and software that could pass or fail each die. The test engineer is the last line of defense between... » read more

New Technologies To Support 3D-ICs


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

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