tag: Sematech

Re-Engineering The FinFET
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

The semiconductor industry is still in the early stages of the [getkc id="185" kc_name="finFET"] era, but the [getkc id="26" kc_name="transistor"] technology already is undergoing a dramatic change. The fins themselves are getting a makeover. In the first-generation finFETs, the fins were relatively short and tapered. In the next wave, the fins are expected to get taller, thinner and more re... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Nov, 2014 - Comments: 0

China’s Jiangsu Changjiang Electronics Technology (JCET) has made a bid to acquire STATS ChipPAC for $780 million, according to reports. This year’s top-20 chip ranking includes two pure-play foundries--TSMC and UMC--and six fabless companies, according to IC Insights. GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia, according to t... » read more

Wanted: Multi-beam E-Beam Inspection
By Mark LaPedus - 18 Sep, 2014 - Comments: 0

The IC industry is making a giant leap from planar devices to a range of next-generation architectures, such as 3D NAND and finFETs. But it’s taking longer than expected to ramp up these new technologies in the market. And the challenges are expected to mount for the next round of chips. It’s difficult to pinpoint the exact issues with 3D NAND and finFETs. On the manufacturing front alo... » read more

Predictive Fab Management
By Michael Watts - 18 Sep, 2014 - Comments: 0

Managing variation requires a different approach in fab management, moving from reactive to predictive methodologies. This is easier said than done, however. Predictive fab management requires a much more detailed understanding of everything happening in the fab, including process variation, equipment variation, mix variation—all of which must be managed with dispatch strategies to produc... » read more

DSA: Hype Or Revolution?
By Michael Watts - 14 Aug, 2014 - Comments: 0

Directed self-assembly (DSA) has become the subject of a great deal of research attention in the lithography world, to the point where there were dedicated sessions at this year’s Advanced Lithography conference in February. So is this just another passing research fad, or is it a technology that will revolutionize semiconductor manufacturing? DSA utilizes a block copolymer that effectivel... » read more

Plotting IBM Micro’s Future
By Mark LaPedus - 14 Aug, 2014 - Comments: 1

It’s been a wild ride for IBM’s Microelectronics Group. Neither IBM, nor the other parties involved, have made any public comments about the recent events concerning IBM Micro. Much of the drama has played out in the media. Based on those reports, here’s a rough outline of the events. Not long ago, IBM put its loss-ridden chip unit on the block to shore up the company’s bottom lin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Aug, 2014 - Comments: 0

Many are suffering from “fragiphoniphobia” without even realizing it, according to Kyocera. This is the fear of fragile phones and worries about the drops and spills ruining our smartphones and disrupting our lives. A recent survey from comScore revealed that 73% of consumers surveyed rated drop protection or scratch-proof/shatter-proof screens as the most desirable durability feature, whil... » read more

Next-Generation Sustainability Gets More Challenging
By Paula Doe - 28 Jul, 2014 - Comments: 0

The semiconductor industry has made major progress on reducing energy usage and water consumption, and effectively abating its emissions, as companies made sustainability a core requirement in their design of new processes and tools. But it’s about to get considerably harder. That means more opportunities to add value with innovative technologies, and also more need for collaboration. Next... » read more

Manufacturing Bits: July 15
By Mark LaPedus - 15 Jul, 2014 - Comments: 0

Multi-beam hits milestone Mapper Lithography has reached a major milestone in its ongoing push to bring multi-beam, direct-write lithography into the mainstream. The Dutch-based company recently installed its initial pre-production tool at CEA-Leti, a French-based R&D organization. The tool, dubbed Matrix 1.1, is a multi-beam, e-beam system for direct-write applications. During the r... » read more

Manufacturing Bits: June 24
By Mark LaPedus - 24 Jun, 2014 - Comments: 0

A cup of sub-wavelength images The National Institute of Standards and Technology (NIST) and the University of Michigan have developed a technology that could enable sub-wavelength images at radio frequencies. Researchers used a mere glass cup, and laser light at optical wavelengths, to measure and image RF fields. In the future, this technology could measure the behavior of metamaterials. ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy