tag: SEMI

High-Quality Data Needed To Better Utilize Fab Data Streams
By Anne Meixner - 10 Jun, 2025 - Comments: 0

Fab operations have wrestled with big data management issues for decades. Standards help, but only if sufficient attention to detail is taken during collection. Semiconductor wafer manufacturing represents one of the most complex manufacturing processes in the world. With each generation of process improvement comes more sophisticated fab equipment, new process recipes, and exponential incre... » read more

Chip Industry Week in Review
By The SE Staff - 06 Jun, 2025 - Comments: 0

Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Blog Review: June 4
By Jesse Allen - 04 Jun, 2025 - Comments: 0

In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

Blog Review: May 28
By Jesse Allen - 28 May, 2025 - Comments: 0

Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors. Cadence’s Vanessa Do checks out how CXL addresses the constant demand f... » read more

Chip Industry Week in Review
By The SE Staff - 23 May, 2025 - Comments: 0

Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Energy-Efficient Computing Systems For Sustainable AI
By Pushkar Apte - 22 May, 2025 - Comments: 0

As artificial intelligence (AI) proliferates rapidly, AI models and datasets are also growing rapidly in size. This growth far outpaces performance improvement in hardware systems, and is increasing AI’s energy consumption unsustainably. To address these challenges and explore collaborative solutions, SEMI’s Smart Data-AI Initiative – as part of its Future of Computing focus – r... » read more

Blog Review: May 21
By Jesse Allen - 21 May, 2025 - Comments: 0

Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers... » read more

Blog Review: May 14
By Jesse Allen - 14 May, 2025 - Comments: 0

Siemens’ Stephen V. Chavez finds that proper PCB high voltage spacing between conductive elements is key to reliability and understanding the principles of clearance (through-air spacing) and creepage (along-surface spacing) is critical. Cadence’s Frank Ferro checks out how the new HBM4 standard boosts bandwidth and addresses key issues in the data center, including the growing size of L... » read more

Blog Review: May 7
By Jesse Allen - 07 May, 2025 - Comments: 0

Cadence’s Mayank Bhatnagar examines the challenge of ensuring the functional safety of disaggregated designs and how UCIe can serve as a certified way to connect individual components. Siemens’ Charlie Olson explores the causes of inter-domain leakage when a DC path is formed between two power rails and how to overcome the limitations of traditional electrical rule checking. Synopsys�... » read more

Chip Industry Week in Review
By The SE Staff - 02 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

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