tag: SEMI

Blog Review: Aug. 14
By Jesse Allen - 14 Aug, 2024 - Comments: 0

Cadence's Dimitry Pavlovsky highlights two new features in the AMBA CHI protocol Issue G update that enhance security of the Arm architecture: Memory Encryption Contexts, which allows data in each Realm in the memory to be encrypted with a different encryption key, and Device Assignment, which introduces hardware provisions to support fully coherent caches in partially trusted remote coherent d... » read more

Blog Review: Aug. 7
By Jesse Allen - 07 Aug, 2024 - Comments: 1

Synopsys' Jyotika Athavale and Randy Fish investigate the problem of silent data corruption caused by difficult-to-detect hardware defects that cause unnoticed errors in the data being processed and is becoming an increasingly pressing problem as computing scales massively at a rapid pace with the demands of AI. Siemens' Keith Felton suggests adopting physical design reuse circuits to provid... » read more

Chip Industry Week in Review
By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Blog Review: July 31
By Jesse Allen - 31 Jul, 2024 - Comments: 0

Cadence's Jasmine Makhija explains how to boost the performance of CXL 3.0 by using NOP (No Operation) Insertion Hints in latency-optimized 256B Flit Mode, which enables the system to quickly revert to the low-latency path after temporarily switching to a higher-latency path due to error correction needs. Synopsys' Robert Fey finds that by automatically and dynamically linking requirements a... » read more

Building A Sustainable And Diverse Semiconductor Workforce: Insights From ASMC 2024 Panel Discussion
By Krish Raghunath - 23 Jul, 2024 - Comments: 0

As the semiconductor industry works to attract talent to overcome its labor shortage, governments, educators, and the private sector must collaborate to make industry career opportunities more accessible for prospective employees. This concept provided the framework for a panel discussion during SEMI’s 35th annual Advanced Semiconductor Manufacturing Conference (ASMC) that took place in Alba... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

Blog Review: July 17
By Jesse Allen - 17 Jul, 2024 - Comments: 0

Cadence's Xin Mu explains the PCIe ECN Unordered IO (UIO) feature in the PCIe 6.1 specification, which defines a new wire semantic and related capabilities to enable multiple-path fabric support and helps avoid unnecessary traffic for better bandwidth and latency. Synopsys' Dana Neustadter, Gary Ruggles, and Richard Solomon highlight the latest updates in the CXL 3.1 standard, including new ... » read more

EDA Revenue Up, China Weak
By Ed Sperling - 15 Jul, 2024 - Comments: 0

EDA and hardware IP revenue grew 14.4% to $4.522 billion in Q1, extending a streak that began several years ago with unabated double-digit growth. But the upbeat report masked a sharp sales drop in China for reasons that have yet to be determined. Revenue in the overall Asia/Pacific region grew a healthy 19% YoY, while China was -6.3%. The negative impact was offset by new strength in India,... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Blog Review: July 10
By Jesse Allen - 10 Jul, 2024 - Comments: 0

Cadence's Paul Graykowski suggests using real number modeling to streamline digital mixed-signal verification using logic simulators and hardware emulators. Siemens' John McMillan and Microsoft's Amit Kumar introduce the basics of 3D-IC, describe the flow and data management challenges, look at the evolution of TSMC 3DBlox 1.0 and 2.0, and detail a physical verification and reliability analy... » read more

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