tag: SEMI

The Week In Review: Manufacturing
By Mark LaPedus - 15 Apr, 2016 - Comments: 0

Chipmakers TSMC remained the world’s largest foundry vendor with a 54.3% share in 2015, according to the rankings from Gartner. GlobalFoundries moved into the No. 2 position with 9.6% of the market. The No. 3 position went to UMC with $4.5 billion in revenue, representing 9.3% of the market, according to the firm, which said Samsung remains No. 4. SMIC, which is No. 5, is gaining ground. ... » read more

Flexible Sensors Begin Ramping
By Jeff Dorsch - 07 Apr, 2016 - Comments: 0

Sensors are at the heart of the [getkc id="76" comment="Internet of Things"]. Flexible sensors promise to extend the Internet of Everything to the battlefield, the gymnasium, the hospital, and many other places. Flexible [getkc id="187" kc_name="sensors"] represent the forefront of a sea of change in electronics, marking the transition from rigid semiconductors made with silicon and other ha... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Mar, 2016 - Comments: 0

Intel announced that the company’s former CEO and chairman, Andrew Grove, passed away. He was 79. Present at Intel’s 1968 founding with Robert Noyce and Gordon Moore, Grove became Intel’s president in 1979 and CEO in 1987. He served as chairman from 1997 to 2005. “We are deeply saddened by the passing of former Intel Chairman and CEO Andy Grove,” said Intel CEO Brian Krzanich, in a st... » read more

China: Strong Market Growth And Innovation In Packaging
By SEMI - 17 Mar, 2016 - Comments: 0

By Shanshan Du Since the mid-1980s, packaging and assembly have been key segments of the semiconductor supply chain in China. In the past decade, the fast growing market of electronic product manufacturing in China occurred concurrently with the innovation and growth in China for packaging and assembly. SEMI China researched the packaging and assembly industry segment and observed a total... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Feb, 2016 - Comments: 0

What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

12 Nations Sign Trade Partnership
By SEMI - 18 Feb, 2016 - Comments: 0

By Taylor Sholler Last week, twelve nations across the Pacific-Rim came together to sign the Trans-Pacific Partnership (TPP) in Auckland New Zealand. These economies, making-up roughly 40 percent of the world's GDP, include Australia, Brunei, Canada, Chile, Japan, Malaysia, Mexico, New Zealand, Peru, Singapore, the U.S., and Vietnam. One of the largest trade agreements in history, the TPP will... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Feb, 2016 - Comments: 0

SUNY Polytechnic Institute (SUNY Poly) and GlobalFoundries announced the establishment of a new Advanced Patterning and Productivity Center (APPC). The $500 million, 5-year program will accelerate the introduction of extreme ultraviolet (EUV) lithography technologies into manufacturing. The center is located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y. -------... » read more

Will 3D-IC Work?
By Ed Sperling - 11 Feb, 2016 - Comments: 3

Advanced packaging is becoming real on every level, from fan-outs to advanced fan-outs, 2.5D, and 3D-ICs for memory. But just how far 3D and monolithic 3D will go isn't clear at this point. The reason is almost entirely due to heat. In a speech at SEMI's Integrated Strategy Symposium in January, Babek Sabi, Intel corporate VP and director of assembly and test technology development, warned t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

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