tag: semiconductor manufacturing

Transformational Opportunities Coming To Semiconductor Manufacturing
By John Kibarian - 11 Feb, 2025 - Comments: 0

During the GSA US Executive Forum in September 2024, a panel discussion brought together Marco Chisari, EVP from Samsung Semiconductor, Jeff Howell, Global VP for High Tech at SAP, and John Kibarian, CEO of PDF Solutions. The purpose of the discussion was to compare and contrast the perspectives from one of the largest global semiconductor companies with that of the most widely used enterpri... » read more

Simulation Closes Gap Between Chip Design Optimization And Manufacturability
By Gregory Haley - 11 Feb, 2025 - Comments: 0

Simulation is playing an increasingly critical and central role throughout the design-through-manufacturing flow, fusing together everything from design to manufacturing and test in order to reduce the number and cost of silicon respins. The sheer density of modern chips, combined with advanced packaging techniques like 3D stacking and heterogeneous integration, has made iterative physical p... » read more

Using AI In Semiconductor Inspection
By Ed Sperling - 05 Feb, 2025 - Comments: 0

AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for different inspection tools and topographies, and knowing which model to use at any particular time. Different textures in backgrounds are difficult for traditional algorithms, for example. But once machine learning models are trained properly, they have proven effective in ... » read more

Assembly Design Rules Slowly Emerge
By Bryon Moyer - 27 Jan, 2025 - Comments: 0

Process design kits (PDKs) play an essential in ensuring that silicon technology can proceed from one generation to the next in a manner that design tools can keep up with. No such infrastructure has been needed for packaging in the past, but that's beginning to change with advanced packages. Heterogeneous assemblies are still ramping up, but their benefits are attracting new designs. “Chi... » read more

What’s Next For Through-Silicon Vias
By Laura Peters - 06 Jan, 2025 - Comments: 0

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias (TSVs) enable shorter interconnect lengths, which reduces chip power consumption and latency to carry signals faster from one device to another or within a device. Advanced packaging technology... » read more

Wafer Bin Map Defect Classification Using Semi-Supervised Learning
By Technical Paper Link - 27 Dec, 2024 - Comments: 0

A new technical paper titled "Semi-Supervised Learning with Wafer-Specific Augmentations for Wafer Defect Classification" was published by researchers at Korea University. Abstract "Semi-supervised learning (SSL) models, which leverage both labeled and unlabeled datasets, have been increasingly applied to classify wafer bin map patterns in semiconductor manufacturing. These models typical... » read more

Semiconductor Engineering’s Special Reports 2024
By The SE Staff - 23 Dec, 2024 - Comments: 0

Semiconductor Engineering published 36 special reports in 2024. Focus Areas Manufacturing, Packaging, Materials Test, Measurement New Fabs and Funding Memory Design Power, Performance Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging  Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Comp... » read more

Monolithic Vs. Heterogeneous Integration
By Ed Sperling - 24 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Review of Automatic EM Image Algorithms for Semiconductor Defect Inspection (KU Leuven, Imec)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review" was published by researchers at KU Leuven and imec. Abstract: "In this review, automatic defect inspection algorithms that analyze Electron Microscope (EM) images of Semiconductor Manufacturing (SM) products are identified, categorized, and discussed. Thi... » read more

SIA’s Report On the State of the U.S. Semiconductor Industry
By Technical Paper Link - 18 Sep, 2024 - Comments: 0

The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report this week, highlighting opportunities for growth, current and emerging challenges, and relevant metrics.  The report reviews the progress made on implementation of the CHIPS Act and associated manufacturing incentives. Supply chain rebalancing, workforce challenges, geopolitics and globa... » read more

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