What’s Changing In Outlier Detection


Commonly used outlier detection approaches, such as parts average testing or determining whether a die is good based upon other dies in the immediate neighborhood, are falling short in advanced packages and SoCs. Some devices may pass tests and still fail in the field. In the past, this was solved by adding margin into designs, but that margin now takes too big a bite out of performance and pow... » read more

Ammonia Plasma Surface Treatment for Improved Cu–Cu Bonding Reliability


A new technical paper titled "Ammonia Plasma Surface Treatment for Enhanced Cu–Cu Bonding Reliability for Advanced Packaging Interconnection" was published by researchers at Myongji University. Abstract "With the emergence of 3D stacked semiconductor products, such as high-bandwidth memory, bonding-interface reliability cannot be overemphasized. The condition of the surface interface befo... » read more

Redefining RAS in Datacenters with Real-Time Health Monitoring


Abstract Hyperscale datacenters require intense computational power for compute-intensive tasks, such as AI, data analytics, machine learning, and big data processing. They leverage parallel processing across multiple computers, in high-density servers, to handle complex tasks efficiently. This uses specialized, powerful processors and training and inference of specific GPUs or ASICs. Such c... » read more

3 Technologies That Will Challenge Test


As chips are deployed in more complex systems and with new technologies, it's not clear exactly what chipmakers and systems vendors will be testing. The standard tests for voltage, temperature and electrical throughput still will be needed, of course. But that won't be sufficient to ensure that sensor fusion, machine learning, or millimeter wave 5/6G will be functioning properly. Each of tho... » read more