Inspecting IC Packages Using Die Sorters

By Mark LaPedus - 18 Apr, 2019 - Comments: 0

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attenti... » read more

Power/Performance Bits: April 2

By Jesse Allen - 02 Apr, 2019 - Comments: 0

DNA programming Computer scientists at California Institute of Technology, University of California, Davis, Maynooth University, and Harvard University created a library of DNA molecules that can self-assemble to compute a variety of algorithms. Each molecule represents a six-bit binary number. The library created by the team is made up of around 700 short pieces, or tiles, of DNA. Each DNA... » read more

System Bits: March 26

By Jeff Dorsch - 26 Mar, 2019 - Comments: 0

Swear to tell the truth Lots of lies are told on the Internet. Shuyuan Ho of Florida State University wants to unveil those falsehoods with an online polygraph. “The future of my research is an online polygraph that could be used many different ways,” said Ho, an associate professor in the College of Communication and Information. “You could use it for online dating, Facebook, Twitter... » read more

Domain Expertise Becoming Essential For Analytics

By Ed Sperling - 12 Mar, 2019 - Comments: 0

Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Shedding Pounds In Automotive Electronics

By Susan Rambo - 12 Mar, 2019 - Comments: 2

Weight is emerging as a key concern for carmakers as more electronic circuitry is added into vehicles that are either fully or partially powered by batteries. As a result, chipmakers and OEMs are exploring alternative substrate materials, different types of sensor fusion, and new ways to reduce the number of wires. Adding pounds reduces driving range for electric or hybrid vehicles. The auto... » read more

Chip Design For The Age Of New Mobility

By Andrew Macleod - 07 Mar, 2019 - Comments: 0

In the new age of mobility, vehicles are valued more and more for their electronic features instead of mechanical specifications. As a result, companies that are able to own and optimize the design of these critical electronics will capture more of the available profit. This is bringing traditional automotive manufacturers into the electronics business, while simultaneously attracting tech comp... » read more

How To Reduce Thermal Guard-Banding

By Ramsay Allen - 14 Feb, 2019 - Comments: 0

Accuracy in temperature sensors can have a big impact in designs from 40nm down to 7nm and beyond, reducing the amount of guard-banding that is required, which in turn can lower the power and extend the life and reliability of components. But at these process geometries, not all sensors measure temperature equally. Thermal guard-banding is a very important consideration for design teams, and... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

An Integrated Simulation Platform to Validate Autonomous Vehicle Safety

By Ansys - 16 Jan, 2019 - Comments: 0

Autonomous driving systems rely upon sensors and embedded software for localization, perception, motion planning and execution. Autonomous driving systems can only be released to the public after developers have demonstrated their ability to achieve extremely high levels of safety. Today’s hands-off autonomous driving systems are largely built with deep learning algorithms that can be trained... » read more

Scaling To Meet Engineering Challenges In Transportation

By Andrew Macleod - 10 Jan, 2019 - Comments: 0

If you’re working on anything related to self-driving cars, you’re likely pondering the tradeoff between what’s technically possible and socially feasible. Example: what do you do if the posted speed is 25mph while the local norms are to travel at least 30 mph? Obey the law and annoy the drivers around you? Or follow the herd and risk the ire of local law enforcement and officials who are... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: sensors