tag: Siemens Digital Industries Software

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Shift Left, Extend Right, Stretch Sideways
By Brian Bailey - 27 Jul, 2023 - Comments: 0

The EDA industry has been talking about shift left for a few years, but development flows are now being stretched in two additional ways, extending right to include silicon lifecycle management, and sideways to include safety and security. In addition, safety and security join verification and power as being vertical concerns, and we are increasingly seeing interlinking within those concerns. ... » read more

Week In Review: Design, Low Power
By Susan Rambo - 14 Jul, 2023 - Comments: 0

DAC and SEMICON WEST rebounded this year, focusing on everything from security to chiplets and smart manufacturing. Panel at DAC conference: Left to right, ARM’s Brian Fuller (moderator), Joe Costello (Metrics, Kwikbit, Arrikto, Acromove), and Wally Rhines (Cornami). Source: Semiconductor Engineering/Ann Mutschler EDA and IP remain strong, approaching $4 billion in Q1, according to ... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips
By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

Challenges Grow For Data Management And Sharing In EDA
By Ed Sperling - 29 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

Week In Review: Design, Low Power
By Susan Rambo - 16 Jun, 2023 - Comments: 0

Intel released Tunnel Falls, its newest quantum research chip, to quantum computing researchers interested in using the 12-qubit silicon chip for their own experiments and research.  Intel is also providing the chips to research laboratories, with help from LQC (LPS Qubit Collaboratory) through the Army Research Office. The first labs to receive the chip are LPS, Sandia National Laboratories, ... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 02 Jun, 2023 - Comments: 0

Arm debuted its latest platform for mobile computing. Arm Total Compute Solutions 2023 adds the new Immortalis-G720 GPU based on the 5th Generation GPU architecture, which redefines parts of the graphics pipeline to reduce memory bandwidth for the next generation of high geometry games and real-time 3D applications. The company also added two new Mali GPUs. In addition, Arm introduced a cluster... » read more

Making Tradeoffs With AI/ML/DL
By Ann Mutschler - 11 May, 2023 - Comments: 0

Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

Week In Review: Design, Low Power
By Susan Rambo - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

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