tag: Siemens

EVs Raise Energy, Power, And Thermal IC Design Challenges
By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Streamline DO-254 Compliance With Model-Based Design
By Jacob Wiltgen - 06 Oct, 2022 - Comments: 0

By Eric Cigan, MathWorks, and Jacob Wiltgen, Siemens EDA The purpose of DO-254 (formally known as RTCA/ DO-254 or ED80) is to provide guidance for the development of airborne electronic hardware. The Federal Aviation Administration (FAA), European Aviation Safety Agency (EASA), and other worldwide aviation safety authorities require this standard to ensure that complex electronic hardware us... » read more

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 30 Sep, 2022 - Comments: 0

Tools and IP Renesas introduced a new microprocessor that enables artificial intelligence to process image data from multiple cameras. "One of the challenges for embedded systems developers who want to implement machine learning is to keep up with the latest AI models that are constantly evolving,” said Shigeki Kato, Vice President of Renesas' Enterprise Infrastructure Business Division. �... » read more

Blog Review: Sept. 28
By Jesse Allen - 28 Sep, 2022 - Comments: 0

Cadence's Paul McLellan shares more highlights from the recent Hot Chips, including some very large chips and accelerators for AI and deep learning, new networks and switches, and mobile and edge processors. Synopsys' Marc Serughetti considers the different use cases for digital twins in automotive and how they can help determine the impact of software on verification, test, and validation a... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 23 Sep, 2022 - Comments: 0

On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 23 Sep, 2022 - Comments: 0

Quantum The $3 million Breakthrough Prize in Fundamental Physics was awarded to four pioneers in the field of quantum information. The laureates are Charles H. Bennett, Gilles Brassard, David Deutsch and Peter Shor. Bennett and Brassard were part of the team that proved the usefulness of entanglement, while Deutsch defined the quantum version of a Turing machine. Shor invented the first "clear... » read more

Strengthening The Global Semi Supply Chain
By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Blog Review: Sept. 21
By Jesse Allen - 21 Sep, 2022 - Comments: 0

Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 16 Sep, 2022 - Comments: 0

Automotive and mobility U.S. President Joe Biden announced the approval of $900 million in funding for a nationwide network of electrical vehicle charging stations in 35 states. The money is part of a multi-year, $7.5 billion plan to create 500,000 charging stations along federal highways. Industry executives told Reuters that remote human supervisors may be a permanent fixture of highly au... » read more

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