Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO


Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

How Mature Are Verification Methodologies?


Semiconductor Engineering sat down to discuss differences between hardware and software verification and changes and challenges facing the chip industry, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president o... » read more

Blog Review: Sept. 14


Synopsys' Godwin Maben, Piyush Sancheti, and Hany Elhak examine some of the top chip design considerations for medical devices and why they require careful analysis of power to reduce the number surgeries to replace batteries, reliability for devices that can be expected to last for ten years or more, and security to protect private medical data and prevent breaches. Siemens' Chris Spear exp... » read more

Designing For Thermal


Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

Testing The Stack: DFT Is Ready For 3D Devices


When existing advanced 2D designs already push the limits of design-for-test (DFT) tools, what hope do developers have of managing DFT for 3D devices? Can anyone afford the tool run time, on-chip area demand, pattern count, and test time? The answer, from an array of experts, is yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs. Well-covered strategies... » read more

Blog Review: Sept. 7


Cadence's Paul McLellan shares highlights from the recent Hot Chips tutorial on CXL and how enhanced memory pooling enables new memory usage models as CXL 3.0 approaches the same speed as DRAM. Synopsys' Sam Tennent and Kamal Desai highlight the emergence of virtual prototyping, its synergy with continuous integration and development setups, and the benefits when these disciplines are combin... » read more

Week In Review: Auto, Security, Pervasive Computing


The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in lockstep with recent moves by the auto industry and related supply chains, as well as cutting-edge research. One of the big breakthroughs is the ability to charge an EV in 10 minutes witho... » read more

Week In Review: Design, Low Power


Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

Blog Review: Aug. 31


Cadence's Paul McLellan wonders what's happened to 450mm wafers as equipment development efforts end, the only wafer fab is decommissioned, and manufacturers see little likelihood to recoup further investment in R&D. Synopsys' Manuel Mota finds that the scale and modular flexibility of chiplets can help meet narrowing time-to-market windows and looks at how UCIe provides a complete stack... » read more

Technical Paper Roundup: Aug. 30


New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

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