Accelerate The Algorithm To Silicon Development With Stratus HLS

By Cadence - 21 Dec, 2022 - Comments: 0

Growth in demand for artificial intelligence (AI) and digital signal processing (DSP) applications, coupled with advances in semiconductor process technology, drives increasingly denser SoCs. These complex SoCs further challenge the design team’s ability to meet performance, power, and area (PPA) goals within tight time-to-market windows. We need automated and targeted solutions that efficien... » read more

How 5G Is Influencing Silicon Design

By Synopsys - 21 Dec, 2020 - Comments: 0

5G is introducing a wide array of challenges in next-generation SoCs that go well beyond high bandwidth wireless. These include increasing system bandwidth, lowering SoC latency, and reducing power significantly for the connected internet of things. Using trusted standards-based IP and proven processing and analog IP at the most aggressive process technology nodes is needed to bring 5G to marke... » read more

Compressing Datasets Created During Silicon Design

By Cadence - 23 Oct, 2019 - Comments: 0

Authors: Guru Rao, Distinguished Engineer; Shakir Abbas, Software Engineering Group Director; Mohammad Mirfendereski, Configuration Management Architect; Cadence. Harsh Sharangpani, CEO and CTO; Rajesh Patil, VP-Business Development; Ascava. During the design cycle for modern semiconductor components, a very large amount of data is generated and stored, often accumulating to hundreds of tera... » read more

Bugs That Kill

By Brian Bailey - 23 Aug, 2018 - Comments: 3

Are simulation-resistant superbugs stifling innovation? That is a question Craig Shirley, president and CEO of Oski Technology, asked a collection of semiconductor executives over dinner. Semiconductor Engineering was invited to hear that discussion and to present the key points of the discussion. To promote free conversation, the participants, who are listed below, asked not to be quoted di... » read more

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Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: silicon design

Accelerate The Algorithm To Silicon Development With Stratus HLS

How 5G Is Influencing Silicon Design

Compressing Datasets Created During Silicon Design

Bugs That Kill

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