Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Blog Review: Oct. 2


In a video, Cadence's Tom Hackett explains finite element analysis by looking at a simple model of a bridge and showing why FEA techniques are required for analysis of real-world structures. Synopsys' Taylor Armerding examines why the 156-year-old False Claims Act has new relevance when companies are accused of failing to meet cybersecurity standards. Mentor's Colin Walls demystifies memo... » read more

Week in Review – IoT, Security, Autos


Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Week in Review: IoT, Security, Autos


Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Week in Review: IoT, Security, Auto


Products/Services Rambus agreed to acquire Hillsboro, Ore.-based Northwest Logic, a purveyor of memory, PCIe, and MIPI digital controllers. The transaction is expected to close in the current quarter. Financial terms weren’t disclosed; Rambus said in a statement, “Although this transaction will not materially impact 2019 results due to the expected timing of close and acquisition accountin... » read more

Blog Review: July 17


Mentor's John McMillan takes a look at the three general classes that have been established by IPC-2221B to reflect progressive increases in sophistication, functional performance requirements, and testing/inspection frequency for PCBs. Synopsys' Dinesh Siwal and Thenmozhy Kaliyamurthy point out the new features and improvements in DisplayPort 2.0, including greater speeds, better power effi... » read more

Week In Review: Manufacturing, Test


Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

Blog Review: July 3


Cadence's Paul McLellan digs into 5G with a two-part post explaining the basics of the technology, what makes it so different from 4G, and the challenges ahead including the limitations of mmWave. Synopsys' Vikramjeet Bamel and Pankaj Sharma note the features that make GDDR6 a dominant memory in the high performance segment and allowing it to expand beyond graphics to automotive, AI, and AR/... » read more

Falling Chip Forecasts


It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Week In Review: Manufacturing, Test


Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

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