tag: silicon lifecycle management

Integrating Data From Design, Manufacturing, And The Field
By Adam Kovac - 13 Mar, 2025 - Comments: 0

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as dimensions become smaller, and as more features are added into devices — especially with heterogeneous assemblies of chiplets running some type of AI — the potential for thermally induced structur... » read more

What’s Changing In Outlier Detection
By Ed Sperling - 12 Mar, 2025 - Comments: 0

Commonly used outlier detection approaches, such as parts average testing or determining whether a die is good based upon other dies in the immediate neighborhood, are falling short in advanced packages and SoCs. Some devices may pass tests and still fail in the field. In the past, this was solved by adding margin into designs, but that margin now takes too big a bite out of performance and pow... » read more

Speeding Down Memory Lane With Custom HBM
By Faisal Goriawalla - 11 Mar, 2025 - Comments: 0

With the goal of increasing system performance per watt, the semiconductor industry is always seeking innovative solutions that go beyond the usual approaches of increasing memory capacity and data rates. Over the last decade, the High Bandwidth Memory (HBM) protocol has proven to be a popular choice for data center and high-performance computing (HPC) applications. Even more benefit can be rea... » read more

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Why Chips Fail, And What To Do About It
By Ed Sperling - 11 Dec, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips in the context of safety- and mission-critical systems, as well as increasing utilization due to an explosion in AI data, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verificat... » read more

Silicon Lifecycle Management Gains Steam
By Laura Peters - 10 Dec, 2024 - Comments: 0

Silicon lifecycle management (SLM) is gaining significant traction, driven increasingly by stringent reliability requirements for safety-critical devices in aerospace, medical, and automotive. Improving reliability has been a discussion point for years, but it has become especially important with the use of chips designed at leading-edge nodes in both mission- and safety-critical application... » read more

Aging, Complexity, And AI In Analog Design
By Ed Sperling - 27 Nov, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss abstraction in analog vs. digital, how analog circuits age, the growing role of AI, and why there is so much margin in analog designs, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal pro... » read more

Yield Management Embraces Expanding Role
By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Advancements In Silicon Device Technology And Design Driving New SLM Monitor Categories
By Ash Patel - 15 Oct, 2024 - Comments: 0

Silicon, the foundation of modern electronics, has seen continuous advancements since the early days of integrated circuits. The pace of innovation has been driven by the relentless quest for miniaturization, increased performance, and efficiency. However, Moore’s Law is no longer a given and silicon is facing functional limitations as technology scales. To address these challenges and conti... » read more

Ensuring Multi-Die Package Quality And Reliability
By Faisal Goriawalla - 08 Aug, 2024 - Comments: 0

Multi-die designs are gaining broader adoption in a wide variety of end applications, including high-performance computing, artificial intelligence (AI), automotive, and mobile. Despite clear advantages, there are new challenges that need to be addressed for successful multi-die realization. This article gives a high-level overview of the multi-die test challenges that go beyond the design p... » read more

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