Week in Review: IoT, Security, Auto

By Jeff Dorsch - 15 Mar, 2019 - Comments: 0

Internet of Things Apple purchased a portfolio of eight granted and pending patents that belonged to Lighthouse AI, a smart home security camera startup that ceased operations near the end of 2018. The portfolio was acquired at about the same time, according to the U.S. Patent & Trademark Office; financial terms weren’t revealed. Also not disclosed, as usual, is what Apple will do with t... » read more

Week In Review: Design, Low Power

By Jesse Allen - 15 Mar, 2019 - Comments: 0

M&A Nvidia will acquire Mellanox for $6.9 billion in cash, the largest deal in the chipmaker's history. Traditionally a PC GPU company, Nvidia has made a push into high-performance computing, particularly for AI workloads. Founded in 1999, Israel-based Mellanox focuses on end-to-end Ethernet and InfiniBand interconnect solutions and services for servers and storage. According to Nvidia, Me... » read more

October ’18 Startup Funding: IoT, Security, Auto

By Jeff Dorsch - 02 Nov, 2018 - Comments: 0

Billions were raised in October for Internet of Things, cybersecurity, automotive electronics, and related technology startups. Automotive October fundings rolled in on the automotive side for Israel’s VayaVision ($8 million) and South Korea-based SOS LAB ($6 million Series A), which are developing products for autonomous vehicles. Silicon Mobility ($10 million Series B), a French startup... » read more

Auto Industry Driving Faster

By Mark Granger - 23 Apr, 2018 - Comments: 0

Automotive electronics used to be a lumbering, trailing-edge business. Not anymore. Today, powerful semiconductor technologies are driving the development of automotive features that once might have been seen as science fiction, such as advanced driver-assistance systems (ADAS) which are paving the way to self-driving cars. Overall, the market for semiconductors in automotive applications is... » read more

Blog Review: April 4

By Jesse Allen - 04 Apr, 2018 - Comments: 0

Synopsys' Richard Solomon explains PCIe's upstream and downstream component naming and why understanding the perspective is key. Mentor's Cristian Filip dives into frequency domain analysis for high data rate SerDes links and the movement toward a simpler way of channel characterization. Cadence's Paul McLellan takes a look at the history of the RISC processors and the death of microcode ... » read more

The Week In Review: Design

By Jesse Allen - 29 Sep, 2017 - Comments: 0

M&A Imagination will sell its MIPS business to Tallwood, a California-based venture capital firm, for $65m in cash. The sale is expected to close in October. The rest of Imagination is slated to be sold to Canyon Bridge for £550 million in cash (~$740 million), a deal dependent on the MIPS sale. The Chinese-backed investment firm has featured recently in the news for its attempted purchas... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 04 Aug, 2017 - Comments: 0

Chipmakers The situation between Toshiba and its fab partner, Western Digital (WD), has gone from bad to worse. As reported, troubled Toshiba recently selected a group to buy its memory business. The consortium includes the Innovation Network Corp. of Japan, the Development Bank of Japan and Bain Capital. Rival SK Hynix is also part of the group. WD attempted but failed to buy the unit, an... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer