Lego-Like Photonics Chip With Expanded RF Bandwidth And Advanced Filter Control

A technical paper titled “Integrated microwave photonic notch filter using a heterogeneously integrated Brillouin and active-silicon photonic circuit” was published by researchers at University of Sydney and Australian National University. Abstract: "Microwave photonics (MWP) has unlocked a new paradigm for Radio Frequency (RF) signal processing by harnessing the inherent broadband and tu... » read more

Front-end patterning and epitaxy approach on Si photonics 220nm SOI substrates

A new technical paper titled "Lateral Tunnel Epitaxy of GaAs in Lithographically Defined Cavities on 220 nm Silicon-on-Insulator" was published by researchers at Cardiff University and University of Southampton. Abstract "Current heterogeneous Si photonics usually bond III–V wafers/dies on a silicon-on-insulator (SOI) substrate in a back-end process, whereas monolithic integration by di... » read more

Research Bits: October 17

High-entropy multielement ink semiconductors Researchers from Lawrence Berkeley National Laboratory and UC Berkeley developed a high-entropy semiconducting material called ‘multielement ink’ that can be processed at low-temperature or room temperature. “The traditional way of making semiconductor devices is energy-intensive and one of the major sources of carbon emissions,” said Pei... » read more

Fabless Approach To Embed Active Nanophotonics in Bulk CMOS By Co-Designing The BEOL Layers For Optical Functionality (MIT)

A technical paper titled “Metal-Optic Nanophotonic Modulators in Standard CMOS Technology” was published by researchers at Massachusetts Institute of Technology. Abstract: "Integrating nanophotonics with electronics promises revolutionary applications ranging from light detection and ranging (LiDAR) to holographic displays. Although semiconductor manufacturing of nanophotonics in Silicon ... » read more

Hardware Security for Silicon Photonic-Based AI Accelerators

A technical paper titled “Integrated Photonic AI Accelerators under Hardware Security Attacks: Impacts and Countermeasures” was published by researchers at Ecole Polytechnique de Montreal and Colorado State University. Abstract: "Integrated photonics based on silicon photonics platform is driving several application domains, from enabling ultra-fast chip-scale communication in high-perfor... » read more

Performance Enhancement Of An Si Photodetector By Incorporating Photon-Trapping Surface Structures

A technical paper titled “Achieving higher photoabsorption than group III-V semiconductors in ultrafast thin silicon photodetectors with integrated photon-trapping surface structures” was published by researchers at University of California Davis, W&WSens Devices Inc., and University of California Santa Cruz. Abstract: "The photosensitivity of silicon is inherently very low in the vis... » read more

III–V Laser Grown on a Patterned Si Photonics Platform With Light Coupling Into Passive SiN Waveguides

A technical paper titled “Unlocking the monolithic integration scenario: optical coupling between GaSb diode lasers epitaxially grown on patterned Si substrates and passive SiN waveguides” was published by researchers at University of Montpellier, Tyndall National Institute, Munster Technological University and Polytechnic University of Bari. Abstract: "Silicon (Si) photonics has recently... » read more

New Standards Push Co-Packaged Optics

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

Research Bits: April 4

Wet-like plasma etching Researchers from Nagoya University and Hitachi developed a new etch method called wet-like plasma etching that combines the selectivity of wet etching with the controllability of dry etching. The researchers say the technique will make it possible to etch complex structures such as metal carbides consisting of titanium (Ti) and aluminum (Al), such as TiC or TiAlC, wh... » read more

Integrating MEMS with Standardized Silicon Photonics Technology

A new technical paper titled "Integrated silicon photonic MEMS" was published by researchers at EPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute. Abstract Excerpt "Here, we introduce a silicon photonic MEMS platform consisting of high-performance nano-opto-electromechanical devices fully integrated alongside standar... » read more

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