Design Automation For Silicon Photonics: Pushing Research Into Production


Silicon photonics is a transformative technology that will have a major impact on system architectures in future IC design applications. Already a major solution for Datacom applications and emerging applications in sensing, design techniques in silicon photonics, with the ability to leverage CMOS technology to integrate large numbers of photonic components, are now being applied to enable opti... » read more

200mm Fab Crunch


Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

Get Ready For Integrated Silicon Photonics


Long-haul communications and data centers are huge buyers of photonics components, and that is leading to rapid advances in the technology and opening new markets and opportunities. The industry has to adapt to meet the demands being placed on it and solve the bottlenecks in the design, development and fabrication of integrated silicon photonics. "Look at the networking bandwidth used across... » read more

LiDAR Goes Back To The Future


LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Ayar Labs: Faster I/O


Startup AyarLabs is using a combination of high-bandwidth fiberoptics, low-cost CMOS fabrication and careful target selection to strike efficiently at the datacenter's worst bottleneck. "Moore's Law only covers the processor, not how we move data in and out of it during processing or how to get the processor and memory working at the same speed," according to Alexandra Wright-Gladstein, co-f... » read more

Predictions: Manufacturing, Devices And Companies


Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

Aeponyx: Optical Chips For Telecom


As the amount of data grows, so does interest in silicon photonics. There is no better way to move data than with light. It's faster, requires less energy, and generates less heat. The main trouble spots come in two places—packaging the light source with another chip, and the switching technology from optical to electrical and back to optical. While companies like Intel have been working o... » read more

System Bits: Oct. 24


Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

Light In A Package


Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using this technology across a wider swath of applications. Progress does appear to be on the horizon, even though exact time frames remain unclear. The advantages of light in communications are wel... » read more

Executive Insight: Lip-Bu Tan


Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of [getentity id="22032" e_name="Cadence"], to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools and business. What follows are excerpts of that conversation. SE: What do you see as the next big thing? Tan: Unlike mobility or cell phones, or PCs before th... » read more

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