Chip Industry Week In Review


CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review


Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Week In Review: Design, Low Power


Tools Cadence's digital and custom/analog flows were certified for TSMC's N3 and N4 process technologies. Updates for the digital flow includes efficient processing of large libraries, additional accuracy during library cell characterization and static timing analysis, and support for accurate leakage calculation required in N3 and static power calculation for new N3 cells. Synopsys' digita... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Synopsys and 3D virtual-environment company Dassault Systèmes are collaborating on an automotive lighting system development platform. Synopsys’ optical design tools — LucidShape, LightTools, and CODE V — will be integrated with Dassault Systèmes' 3DEXPERIENCE Platform, which is used by automotive teams from different disciplines to work together on designs and simulations. ... » read more