Week In Review: Manufacturing, Test

By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Power/Performance Bits: Dec. 21

By Jesse Allen - 21 Dec, 2021 - Comments: 0

Compact optical amplifier Researchers at Chalmers University of Technology propose a new optical amplifier design that is compact, high-performance, and doesn't generate excess noise. “We have developed the world's first optical amplifier that significantly enhances the range, sensitivity and performance of optical communication, that does not generate any excess noise – and is also com... » read more

Manufacturing Bits: March 16

By Mark LaPedus - 16 Mar, 2021 - Comments: 0

Tripping up neural networks For years, Russia has been an active area in R&D. In one example, Russia's Skolkovo Institute of Science and Technology (Skoltech) has demonstrated how certain patterns can cause neural networks to make mistakes in recognizing images. Leveraging the theory behind this research, Skoltech can design defenses for pattern recognition systems that are vulnerable t... » read more

Manufacturing Bits: Nov. 25

By Mark LaPedus - 25 Nov, 2019 - Comments: 0

RF carbon nanotubes For years, the industry has been working on logic and memory devices based on carbon nanotubes, although these technologies remain in R&D. Now, there is a new device type using carbon nanotubes--RF. Startup Carbonics has developed an RF-based carbon nanotube technology that operates at frequencies over 100GHz. The technology exceeds the cutoff frequency of today�... » read more

Manufacturing Bits: Aug. 20

By Mark LaPedus - 20 Aug, 2019 - Comments: 0

Making carbon nanotubes with AI Russia’s Skolkovo Institute of Science and Technology (Skoltech) has developed a method to monitor the growth of carbon nanotubes using an artificial intelligence (AI) technology called machine learning. Skoltech used AI to predict the performance of the synthesis of single-walled carbon nanotubes using a chemical vapor deposition (CVD) process. The tec... » read more

Manufacturing Bits: Nov. 20

By Mark LaPedus - 20 Nov, 2018 - Comments: 0

Predicting crystal structures A group of researchers have improved a crystal structure prediction algorithm, enabling the ability to develop new crystal structures and compounds at faster rates. In 2005, Artem Oganov, now a professor at the Skolkovo Institute of Science and Technology (Skoltech) and the Moscow Institute of Physics and Technology (MIPT), developed a crystal structure predic... » read more

System Bits: Oct. 3

By Ann Mutschler - 03 Oct, 2017 - Comments: 0

Polariton graphs In a development that a team of researchers from the UK and Russia say could eventually surpass the capabilities of even the most powerful supercomputers, a type of ‘magic dust’ — which combines light and matter — can be used to solve complex problems. Hailing from the University of Cambridge, University of Southampton and Cardiff University in the UK and the Skolk... » read more

Manufacturing Bits: Feb. 14

By Mark LaPedus - 14 Feb, 2017 - Comments: 0

Making quark soup CERN, the European Organization for Nuclear Research, recently presented its latest results on quark-gluon plasma, or quark soup, a state of matter that supposedly existed during the early formation of the universe. For this, CERN used the Large Hadron Collider (LHC), the world’s most powerful particle accelerator. The LHC is situated in a tunnel 100 meters underground ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Skolkovo Institute of Science and Technology