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Week In Review: Manufacturing, Test
By Karen Heyman - 16 Sep, 2022 - Comments: 0

President Biden signed an executive order on Sept. 15, limiting foreign investments in U.S. technology by "competitor or adversarial nations" that are deemed a threat to national security. In the past, the Committee on Foreign Investment in the United States (CFIUS) largely limited its actions to the sale of U.S. companies. The new directive expands that to include investments involving "U.S. s... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 22 Jul, 2022 - Comments: 0

Ramping capacity Samsung is considering building as many as 11 fabs in central Texas, investing an estimated $200 billion and creating as many as 10,000 jobs. The plans came to light when the company filed paperwork for tax breaks. Samsung already has broken ground on a new $17 billion fab in Taylor, Texas. The remaining nine fabs, including two in nearby Austin, would be built over the next c... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Jul, 2022 - Comments: 0

IP, design Arm unveiled a number of new CPUs and GPUs. Based on the Armv9 architecture, the Cortex-X3 aims to improve single-threaded performance and targets a range of benchmarks and applications. The Cortex-A715 focuses on efficient performance, delivering a 20% energy efficiency gain and 5% performance uplift compared to Cortex-A710. In addition, the Cortex-A510 and DSU-110 were updated to ... » read more

Silicon-based Power Semis Face Challenges
By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

200mm Shortages May Persist For Years
By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Jan, 2022 - Comments: 0

Chipmakers, OEMs TSMC reported sales of $15.736 billion for the fourth quarter of 2021, up 5.7% sequentially. Net income grew 6.4% quarter-over-quarter. In the fourth quarter, shipments of 5nm accounted for 23% of total wafer revenues, while 7nm accounted for 27%. In the first quarter of 2022, TSMC’s sales are expected to be between $16.6 billion to $17.2 billion. TSMC also expects its 20... » read more

Expanding Advanced Packaging Production In The U.S.
By Mark LaPedus - 05 Jan, 2022 - Comments: 0

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

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