What’s So Important About Processor Extensibility?

By Brian Bailey - 28 May, 2020 - Comments: 1

While the ability to extend a processor is nothing new, market dynamics are forcing a growing percentage of the industry to consider it a necessary part of their product innovation. From small IoT functions to massive data centers and artificial intelligence, the need to create an optimized processing platform is often the only way to get more performance or lower power out of the silicon area ... » read more

ANSYS HFSS and SGI UV 2000 Takes Electromagnetic Simulation To New Heights

By Ansys - 09 Sep, 2015 - Comments: 0

This white paper discusses how the latest version of ANSYS HFSS (Release 16) takes full advantage of the SGI UV2000 advanced symmetric multiprocessing (SMP) system to achieve these objectives. Utilizing SGI’s sixth generation technology, engineers and scientists can leverage hundreds of processing cores and terabytes of coherent shared memory to solve very large EM field simulations, as well ... » read more

Experts At The Table: Latency

By Ed Sperling - 25 Jan, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance engineering sat down to discuss latency with Chris Rowen, CTO at Tensilica; Andrew Caples, senior product manager for Nucleus in Mentor Graphics’ Embedded Software Division; Drew Wingard, CTO at Sonics; Larry Hudepohl, vice president of hardware engineering at MIPS; and Barry Pangrle, senior power methodology engineer at Nvidia. What follows are exce... » read more

Keeping The Balance

By Ed Sperling - 13 Sep, 2012 - Comments: 0

By Ann Steffora Mutschler The brains of datacenters today are more powerful than ever due to technology advancements in chip architectures and in manufacturing processes that allow more processing power thanks to Moore’s Law. But knowing exactly how and where to configure the processors and cores for optimum throughput and performance within a certain power budget raises a number of qu... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SMP

What’s So Important About Processor Extensibility?

ANSYS HFSS and SGI UV 2000 Takes Electromagnetic Simulation To New Heights

Experts At The Table: Latency

Keeping The Balance