New AI Processors Architectures Balance Speed With Efficiency

By Ed Sperling - 04 Sep, 2024 - Comments: 1

Leading AI systems designs are migrating away from building the fastest AI processor possible, adopting a more balanced approach that involves highly specialized, heterogeneous compute elements, faster data movement, and significantly lower power. Part of this shift revolves around the adoption of chiplets in 2.5D/3.5D packages, which enable greater customization for different workloads and ... » read more

Digital Twins Find Their Footing In IC Manufacturing

By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

How To Scale Application Security Across The Enterprise

By Synopsys - 24 Apr, 2024 - Comments: 0

Enterprise organizations have hundreds of developers on numerous teams in dozens of business units. They are all working on thousands of applications, releasing software in very rapid iteration cycles. The challenges of development across all these software development life cycles, business units, and organizational silos are well known, and the sheer scale of enterprise development multiplies ... » read more

Optimizing Energy At The System Level

By Brian Bailey - 18 Mar, 2024 - Comments: 0

Power is a ubiquitous concern, and it is impossible to optimize a system's energy consumption without considering the system as a whole. Tremendous strides have been made in the optimization of a hardware implementation, but that is no longer enough. The complete system must be optimized. There are far reaching implications to this, some of which are driving the path toward domain-specific c... » read more

Changes And Challenges In Auto MCUs

By Ed Sperling - 13 Mar, 2024 - Comments: 0

Microcontrollers have been a key component in automotive for years, starting with single-core devices with limited on-chip memory for very basic functions, and evolving toward multi-core systems with more memory for more complex tasks. But as vehicles become increasingly automated, microcontrollers are changing significantly, and so is the perception of how to utilize them. These new devices ne... » read more

Arm Statistical Profiling Extension: Performance Analysis Methodology

By Arm - 14 Dec, 2023 - Comments: 0

This paper presents a methodology for workload characterization and root cause analysis using the Arm Statistical Profiling Extension (SPE) demonstrated on a Neoverse N1 core. The target audience are software developers and performance analysts in software development, analysis, optimization, and tuning. This paper may also help silicon engineers to conduct performance analysis and debugging. T... » read more

Security Becoming Core Part Of Chip Design — Finally

By Ann Mutschler - 07 Dec, 2023 - Comments: 1

Security is shifting both left and right in the design flow as chipmakers wrestle with how to build devices that are both secure by design and resilient enough to remain secure throughout their lifetimes. As increasingly complex devices are connected to the internet and to each other, IP vendors, chipmakers, and systems companies are racing to address existing and potential threats across a ... » read more

Software Stack For Edge AI Performance

By Suhas Mitra - 05 Oct, 2023 - Comments: 0

Developing an agile software stack is important for successful AI deployment on the edge. We regularly encounter new machine learning models created from multiple AI frameworks that leverage the latest primitives and state-of-the-art ML model topologies. This Cambrian explosion has resulted from a fertile open-source community that has embraced AI and is now fueling a wide proliferation of ML m... » read more

Why Chiplets Don’t Work For All Designs

By Ed Sperling - 20 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

RISC-V Customization Gets A Standing Ovation

By Mike Eftimakis - 24 Aug, 2023 - Comments: 0

Processor vendors have always tried to create a large software ecosystem around their products, because it creates stickiness and it naturally “locks-in” large numbers of customers who have invested in the creation of dedicated software. This effect is growing over time as the quantity of software is ever increasing per product: we could talk about more than 100 million lines of code in a c... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?