Will Directed Self-Assembly Pattern 14nm DRAM?

By Mattan Kamon - 17 Mar, 2016 - Comments: 1

Will directed self-assembly (DSA) join Extreme Ultraviolet (EUV) Lithography and next-generation multi-patterning techniques to pattern the next memory and logic technologies? Appealing to the wisdom of crowds, the organizers of the 2015 1st International DSA symposium recently surveyed the attendees. Nearly 75% believed DSA would insert into high-volume manufacturing within the next 5 years... » read more

Manufacturing Bits: March 15

By Mark LaPedus - 15 Mar, 2016 - Comments: 0

More multi-beam The multi-beam e-beam market is a hot topic. For example, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications. Meanwhile, at the recent SPIE Advanced Lithography conference, Mapper Lithography disclosed new upgrades for its multi-beam e-beam tool for use in direct-write lithography application... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 26 Feb, 2016 - Comments: 0

What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 19 Feb, 2016 - Comments: 0

The SPIE Advanced Lithography conference is next week. “The conference should provide an update on extreme ultraviolet lithography (EUV) sentiment from chipmakers such as Intel and TSMC, and we expect generally positive sentiment, which should be good for ASML. Still, high-volume adoption timing of EUV appears to be in the 2020 time frame, so it's very early in the process. We expect a lot of... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 16 Oct, 2015 - Comments: 0

Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

Litho Challenges Break The Design-Process Wall

By Katherine Derbyshire - 22 Jun, 2015 - Comments: 3

The days when chip designers could throw tape “over the wall” to the manufacturing side are long gone. Over the last several technology generations, increasingly restrictive process kits have forced designers to accommodate their circuit structures to the manufacturing process. Lacking a successor to 193nm lithography, the industry has turned to increasingly complex resolution enhancemen... » read more

Challenges Mount For Patterning And Masks

By Mark LaPedus - 06 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="80" comment="lithography"] and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief execu... » read more

DSA Defects Continue Downward Trend

By Katherine Derbyshire - 06 Apr, 2015 - Comments: 0

As previously discussed, the majority of defects in early directed self-assembly (DSA) processes were due to particles and other contaminants, and could be attributed to the immaturity of the process and materials. As manufacturers consider whether to incorporate DSA into specific technology nodes, they need to assure themselves that production-worthy yields can be achieved. Recent research at ... » read more

Challenges Mount For Patterning And Masks

By Mark LaPedus - 30 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief executive at [getentity id="228... » read more

Manufacturing Bits: March 24

By Mark LaPedus - 24 Mar, 2015 - Comments: 0

Mouse brains to multi-beam At the recent SPIE Advanced Lithography conference, Sematech provided an update on its multi-beam, e-beam inspection program. The goal is to develop a next-generation inspection tool, which could be faster than traditional e-beam inspection and could one day displace brightfield inspection. “Optical inspection is having trouble detecting particles that are small... » read more

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tag: SPIE

Will Directed Self-Assembly Pattern 14nm DRAM?

Manufacturing Bits: March 15

The Week In Review: Manufacturing

The Week In Review: Manufacturing

The Week In Review: Manufacturing

Litho Challenges Break The Design-Process Wall

Challenges Mount For Patterning And Masks

DSA Defects Continue Downward Trend

Challenges Mount For Patterning And Masks

Manufacturing Bits: March 24